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Trade Name:STM32MP135CAG3
Data Manual:STM32MP135CAG3.pdf
Brand:ST
Particular Year:23+
Package:TFBGA289
Delivery Date:New and Original
Stock: 1000pcs
The STM32MP135CAG3 devices provide an external SDRAM interface supporting external memories up to 8-Gbit density (1 Gbyte), 16-bit LPDDR2/LPDDR3 or DDR3/DDR3L up to 533 MHz.
The STM32MP135CAG3 devices incorporate high-speed embedded memories with 168 Kbytes of internal SRAM (including 128 Kbytes of AXI SYSRAM, two banks of 8 Kbytes and one bank of 16 Kbytes securable AHB SRAM, and 8 Kbytes of SRAM in Backup domain), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, and a 64-bit multi-layer AXI interconnect supporting internal and external memories access.
Features
1.71 V to 3.6 V I/Os supply (5 V-tolerant I/Os)
POR, PDR, PVD and BOR
On-chip LDOs (USB 1.8 V, 1.1 V)
Backup regulator (~0.9 V)
Internal temperature sensors
Low-power modes: Sleep, Stop, LPLV-Stop, LPLVStop2 and Standby
DDR retention in Standby mode
Controls for PMIC companion chip
Clock management
Internal oscillators: 64 MHz HSI oscillator, 4 MHz CSI oscillator, 32 kHz LSI oscillator
External oscillators: 8-48 MHz HSE oscillator, 32.768 kHz LSE oscillator
4 × PLLs with fractional mode
General-purpose input/outputs
Up to 135 secure I/O ports with interrupt capability
Up to 6 wakeup
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The STMicroelectronics (ST) Group was established in 1987 by the merger of Italys SGS Microelectronics and Frances Thomson Semiconductor. In May 1998, SGS-THOMSON Microelectronics changed the company name to STMicroelectronics Limited. STMicroelectron…
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