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Shenzhen  Mingjiada Electronics Co., Ltd.

Service Telephone:86-755-83294757

Product Classification

Product Picture

Model

Brand

Parameter Description

MOQ

Stock

Purchase Quantity

Unit Price

Operation

CYW20829B0LKMLXQLA1

Product Description:Bluetooth LE 5.4 MCU with Dual ARM Cortex M33 dedicated for applications and CAN FD

Package:QFN-56
10pcs
1000
1 +
10 +
25 +
50 +
>=100
QLN-1036-0-50PSP-TR-02-0

Product Description:Bluetooth version 5.0 qualified stack with optional features

Package:QFN
10pcs
1000
1 +
10 +
25 +
50 +
>=100
QLN-1021-0-24PSP-TR-04-0

Product Description:Bluetooth version 5.0 qualified stack with optional features

Package:QFN
10pcs
1000
1 +
10 +
25 +
50 +
>=100
DA14592-010006F2

Product Description:SmartBond™ Multi-Core Low Power Bluetooth® 5.2 SoC with Embedded Flash Memory

Package:WLCSP
10pcs
2000
1 +
10 +
25 +
50 +
>=100
DA14592-01000O92

Product Description:SmartBond™ Multi-Core Low Power Bluetooth® 5.2 SoC with Embedded Flash Memory

Package:WLCSP
10pcs
2000
1 +
10 +
25 +
50 +
>=100
QN9083DUKZ
NXP

Product Description:IC RF TxRx + MCU Bluetooth Bluetooth v5.0 32MHz 47-XFBGA, WLCSP

Package:47-WLSCP
10pcs
1000
1 +
10 +
25 +
50 +
>=100
KW45B41Z82AFTBR
NXP

Product Description:KW45: 32-bit Bluetooth® 5.3, Remote MCU with CAN FD and LIN bus options, Arm® Cortex®-M33 core

Package:HVQFN48
10pcs
2000
1 +
10 +
25 +
50 +
>=100
CC2541F128RHAR
TI

Product Description:IC RF TxRx + MCU Bluetooth Bluetooth v5.0 2.4GHz 40-VFQFN Exposed Pad

Package:VQFN40
10pcs
2500
1 +
10 +
25 +
50 +
>=100
KW45B41Z53AFTBT
NXP

Product Description:32-Bit Bluetooth® 5.3 Long-Range MCUs with CAN FD and LIN Bus Options, Arm® Cortex®-M33 Core

Package:HVQFN40
10pcs
1000
1 +
10 +
25 +
50 +
>=100
KW45B41Z53AFPBT
NXP

Product Description:32-Bit Bluetooth® 5.3 Long-Range MCUs with CAN FD and LIN Bus Options, Arm® Cortex®-M33 Core

Package:HVQFN40
10pcs
1000
1 +
10 +
25 +
50 +
>=100
KW45B41Z52AFTBT
NXP

Product Description:32-bit Bluetooth® 5.3, Remote MCU with CAN FD and LIN bus options, Arm® Cortex®-M33 core

Package:HVQFN48
10pcs
1000
1 +
10 +
25 +
50 +
>=100
QCC-5181-0-WLNSP99-TR-05-0

Product Description:High-performance Bluetooth v5.4 chip for Bluetooth headsets and wearables

Package:WLCSP
10pcs
1000
1 +
10 +
25 +
50 +
>=100
QCA-4024-0-68CMQFN-TR-0D-0

Product Description:Multi-mode intelligent connectivity solution integrating IEEE 802.15.4 and Bluetooth

Package:QFN-68
10pcs
1000
1 +
10 +
25 +
50 +
>=100
QCC-3071-0-WLNSP99-HR-04-0

Product Description:Ultra-low power, single-chip audio platforms

Package:WLCSP-99
10pcs
1000
1 +
10 +
25 +
50 +
>=100
QCC-5181-0-WLNSP99-SR-05-0

Product Description:Advanced, ultra-low power, single-chip audio platforms

Package:WLCSP-99
10pcs
1000
1 +
10 +
25 +
50 +
>=100
QCA6678AQ

Product Description:Wi-Fi 6e Single MAC 802.11ax MIMO 2x2 Bluetooth 5.3 for Automotive Applications

Package:QFN
10pcs
1000
1 +
10 +
25 +
50 +
>=100
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Contact Number:86-755-83294757

Enterprise QQ:1668527835/ 2850151598/ 2850151584/ 2850151585

Business Hours:9:00-18:00

E-mail:sales@hkmjd.com

Company Address:Room1239, Guoli building, Zhenzhong Road, Futian District, Shenzhen, Guangdong

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