sales@hkmjd.com
Service Telephone:86-755-83294757
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Product Description:Wi-Fi Front-End Modules (FEMs) For IEEE802.11b/g/ac/ax/be applications
Package:BGAProduct Description:Wi-Fi Front-End Modules (FEMs) For IEEE802.11b/g/ac/ax/be applications
Package:BGAProduct Description:Wi-Fi Front-End Modules, 50Ω RF ports
Package:BGAProduct Description:Low Power Entry-Level Bluetooth Audio SoC
Package:WLCSP-99Product Description:Low Power Entry-Level Bluetooth Audio SoC
Package:WLCSP-99Product Description:Entry-Level Flash Low-Power Bluetooth Audio SoC
Package:QFN-80Product Description:Entry-Level Flash Low-Power Bluetooth Audio SoC
Package:QFN-80Product Description:Entry-Level Flash Low-Power Bluetooth Audio SoC
Package:VFBGA-90Product Description:Entry-Level Flash Low-Power Bluetooth Audio SoC
Package:VFBGA-90Product Description:Extremely low power premium tier Bluetooth Audio SoC in a WLCSP package
Package:WLCSP-81Product Description:Programmable Entry Level Flash Bluetooth Audio SoC
Package:BGAProduct Description:Programmable Entry Level Flash Bluetooth Audio SoC
Package:BGAProduct Description:Extremely Low Power, Entry-Level Flash Bluetooth Audio SoC
Package:QFN-80Product Description:Extremely Low Power, Entry-Level Flash Bluetooth Audio SoC
Package:QFN-80Product Description:Single-chip Bluetooth audio SoC designed for USB dongles
Package:WLCSP-99Contact Number:86-755-83294757
Enterprise QQ:1668527835/ 2850151598/ 2850151584/ 2850151585
Business Hours:9:00-18:00
E-mail:sales@hkmjd.com
Company Address:Room1239, Guoli building, Zhenzhong Road, Futian District, Shenzhen, Guangdong
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