sales@hkmjd.com
Service Telephone:86-755-83294757
Trade Name:Bluetooth IC
Brand:QUALCOMM
Particular Year:24+
Package:BGA
Delivery Date:New and Original
Stock: 3000pcs
The QCC-3005-1-68CSP-TR-00-0 is a Programmable entry-level flash audio SoC designed for optimizing Bluetooth® headset and speaker applications.
The QCC3005 flexible System-on-Chip (SoC) support increased OEM customization and are engineered to offer a rich set of audio features which have not typically been associated with mid to low tier Bluetooth wireless audio devices.
The QCC3005 supports Bluetooth headset applications. Coupled with the audio development kit (ADK) and tools, this device helps to provide a flexible, cost effective platform for designing high quality Bluetooth audio products.
A single-chip dual-mode Bluetooth 5 system, QCC3005 SoC features 8th generation Qualcomm® cVc™ Noise Cancellation Technology with one and two microphone inputs; an enhanced GAIA designed for better communication with mobile devices; and has external QSPI flash memory for configuration and voice prompts.
Specifications
CPU
Clock Speed: Up to 80 MHz
DSP
Name: Qualcomm® Kalimba™
Bluetooth
Specification Version: Bluetooth® 5.0
Connection Technology: Bluetooth® Low Energy, Bluetooth® Classic, Dual-mode Bluetooth®
Classic Profiles: Bluetooth® Advanced Audio Distribution Profile (A2DP) 1.3, Bluetooth® Audio/Video Remote Control Profile (AVRCP) 1.5, Bluetooth® Hands-Free Profile (HFP) 1.7
Audio
Qualcomm® aptX™ audio technology support: Qualcomm® aptX™ Audio
Qualcomm® cVc™ Echo Cancelling and Noise Suppression (ECNS) technology support: Qualcomm® cVc™ Echo Cancelling and Noise Suppression
Flash
Density: Up to 64 MB
Location: External
Interfaces
Supported Interfaces: I²S, USB 3.0, USB 2.0, S/PDIF, 2x Digital Microphone In
Audio Playback Interfaces
Modes: Stereo
Digital Microphones
Number of Interfaces: 2
Universal Serial Bus (USB)
Specification Version: USB 2.0, USB 3.0
Package
Type: QFN, BGA
Size: 5.5 × 5.5 × 1 mm1, 6.0 × 6.0 × 0.6 mm2
Pitch: 0.4 mm2, 0.5 mm1
Model
Brand
Package
Quantity
Describe
REALTEK
QFP
2000
Support for Bluetooth 5.3, ultra-low power, 2-in-1 watches and TWS solutions
QUALCOMM
WLCSP-81
3600
Extremely low power premium tier Bluetooth Audio SoC in a WLCSP package
QUALCOMM
WLCSP
1000
High-performance Bluetooth v5.4 chip for Bluetooth headsets and wearables
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A: You can inquire through the website, or by phone and email.
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A: you can issue ordinary invoices for individual users or special VAT invoices for enterprise users.
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