sales@hkmjd.com
Service Telephone:86-755-83294757
Trade Name:Bluetooth IC
Brand:QUALCOMM
Particular Year:24+
Package:BGA
Delivery Date:New and Original
Stock: 3000pcs
The QCC3005 flexible System-on-Chip (SoC) support increased OEM customization and are engineered to offer a rich set of audio features which have not typically been associated with mid to low tier Bluetooth wireless audio devices.
The QCC3005 supports Bluetooth headset applications. Coupled with the audio development kit (ADK) and tools, this device helps to provide a flexible, cost effective platform for designing high quality Bluetooth audio products.
A single-chip dual-mode Bluetooth 5 system, QCC3005 SoC features 8th generation Qualcomm® cVc™ Noise Cancellation Technology with one and two microphone inputs; an enhanced GAIA designed for better communication with mobile devices; and has external QSPI flash memory for configuration and voice prompts.
Features
Dual-mode Bluetooth 5 qualified radio
Variants designed to address both headsets/headphones and speaker applications
Low-power Qualcomm® Kalimba™ DSP with on-chip ROM and RAM, stereo codec, battery charger, switch mode and linear regulators and LED drivers in a single chip solution
Customizable application code
Access to technologies such as Link Layer and Dual Mode topologies (LLT/DMT), Qualcomm® aptX™, cVc noise cancellation technology
A rich set of features, use cases and programmability at more cost-effective price points
Pin compatible with CSRA63xxx and CSRA64xxx family of products
Supports OTA updates
Integrated Qualcomm TrueWireless Stereo technology
Qualcomm® meloD™ Expansion audio processing: 3D stereo widening
SBC and AAC codecs
Promotes reduced development time with support of application image and source code, IDE and configuration
Updated Generic Application Interface Architecture (GAIA) protocol v3
Model
Brand
Package
Quantity
Describe
REALTEK
QFP
2000
Support for Bluetooth 5.3, ultra-low power, 2-in-1 watches and TWS solutions
QUALCOMM
WLCSP-81
3600
Extremely low power premium tier Bluetooth Audio SoC in a WLCSP package
QUALCOMM
WLCSP
1000
High-performance Bluetooth v5.4 chip for Bluetooth headsets and wearables
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A: You can inquire through the website, or by phone and email.
A: the delivery date is marked in most commodity information. You can estimate the delivery time of the commodity according to the delivery date. The specific arrival time depends on the warehouse where the commodity is located and the logistics mode you choose.
A: you can issue ordinary invoices for individual users or special VAT invoices for enterprise users.
Qualcomm was founded in 1985 and is headquartered in San Diego, California, with more than 35,400 employees worldwide. Qualcomm is the worlds leading wireless technology innovator, transforming the way the world connects, computes and communicates. Co…
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