sales@hkmjd.com
Service Telephone:86-755-83294757
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Product Description:Highly integrated cost-effective Bluetooth audio SoC with dual-mode Bluetooth 5.3 support
Package:BGAProduct Description:Bluetooth audio SoC with Bluetooth 5.3 support
Package:BGAProduct Description:Highly integrated Bluetooth SoC with dual-mode Bluetooth 5.3 support
Package:BGAProduct Description:BES2600IHC series adopts dual-core Arm MCU and supports Bluetooth 5.3
Package:QFNProduct Description:Bluetooth audio SoC with Bluetooth 5.3 support
Package:QFNProduct Description:Ultra-low power Bluetooth audio SoC with Bluetooth 5.3 support
Package:BGAProduct Description:Ultra Low Power Bluetooth Audio SoCs
Package:BGAProduct Description:BES2600YP Bluetooth Audio SOC, a new generation of ultra-low power Bluetooth audio SoC from BES
Package:BGAProduct Description:The BES2700YP is BES latest generation of ultra-low power, highly integrated Bluetooth audio SoCs
Package:BGAProduct Description:The BES2300-YP is a highly integrated SoC with Bluetooth 5.0 dual-mode
Package:BGAProduct Description:BES2500YP-60 ultra-low power Bluetooth audio SoC with support for Bluetooth 5.2 standard
Package:BGAProduct Description:BES2500Z-80 ultra-low power Bluetooth audio SoC with support for Bluetooth 5.2 standard
Package:BGAContact Number:86-755-83294757
Enterprise QQ:1668527835/ 2850151598/ 2850151584/ 2850151585
Business Hours:9:00-18:00
E-mail:sales@hkmjd.com
Company Address:Room1239, Guoli building, Zhenzhong Road, Futian District, Shenzhen, Guangdong
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