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Shenzhen  Mingjiada Electronics Co., Ltd.

Service Telephone:86-755-83294757

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AI Processor Chip

AI Accelerators

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M393A8G40BB4-CWE

Product Description:RDIMM Dual In-Line In-Line Memory Module with Memory

Package:BGA-288
10pcs
10000
1 +
10 +
25 +
50 +
>=100
M393A4K40EB3-CWE

Product Description:RDIMM Dual In-Line In-Line Memory Module with Memory

Package:BGA-288
10pcs
10000
1 +
10 +
25 +
50 +
>=100
M321R8GA0PB0-CWM

Product Description:RDIMM Dual In-Line In-Line Memory Module with Memory

Package:BGA-288
10pcs
10000
1 +
10 +
25 +
50 +
>=100
M321R8GA0BB0-CQK

Product Description:RDIMM Dual In-Line In-Line Memory Module with Memory

Package:BGA-288
10pcs
10000
1 +
10 +
25 +
50 +
>=100
M393A4K40DB2-CVF

Product Description:RDIMM Dual In-Line In-Line Memory Module with Memory

Package:BGA-288
10pcs
10000
1 +
10 +
25 +
50 +
>=100
K3LKBKB0BM-MGCP

Product Description:Low-Power Dynamic Random Access Memory IC

Package:315-FBGA
10pcs
2000
1 +
10 +
25 +
50 +
>=100
K4UCE3Q4AA-MGCL

Product Description:64Gbit LPDDR4X Dynamic Random Memory (DRAM) IC For Mobile Devices

Package:FBGA-200
10pcs
2000
1 +
10 +
25 +
50 +
>=100
K3LKDKD0CM-BGCP

Product Description:Low-Power Dynamic Random Access Memory IC

Package:496-FBGA
10pcs
2000
1 +
10 +
25 +
50 +
>=100
K4UCE3Q4AA-MGCR

Product Description:64Gbit LPDDR4X Dynamic Random Memory (DRAM) IC For Mobile Devices

Package:FBGA-200
10pcs
2000
1 +
10 +
25 +
50 +
>=100
K3LK7K70BM-JGCP

Product Description:Low-Power Dynamic Random Access Memory IC

Package:441-FBGA
10pcs
2000
1 +
10 +
25 +
50 +
>=100
K3LK6K60BM-BGCP

Product Description:Low-Power Dynamic Random Access Memory IC

Package:496-FBGA
10pcs
2000
1 +
10 +
25 +
50 +
>=100
K4U8E3S4AD-GUCL

Product Description:8Gbit LPDDR4X Dynamic Random Memory (DRAM) IC For Mobile Devices

Package:FBGA-200
10pcs
2000
1 +
10 +
25 +
50 +
>=100
K3LK6K60BM-JUCP

Product Description:Low-Power Dynamic Random Access Memory IC

Package:441-FBGA
10pcs
2000
1 +
10 +
25 +
50 +
>=100
K3LK6K60BM-JGCP

Product Description:Low-Power Dynamic Random Access Memory IC

Package:441-FBGA
10pcs
2000
1 +
10 +
25 +
50 +
>=100
K4U8E3S4AD-GHCL

Product Description:8Gbit LPDDR4X Dynamic Random Memory (DRAM) IC For Mobile Devices

Package:FBGA-200
10pcs
2000
1 +
10 +
25 +
50 +
>=100
K3LK6K60BM-JFCP

Product Description:Low-Power Dynamic Random Access Memory IC

Package:441-FBGA
10pcs
2000
1 +
10 +
25 +
50 +
>=100
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Contact Number:86-755-83294757

Enterprise QQ:1668527835/ 2850151598/ 2850151584/ 2850151585

Business Hours:9:00-18:00

E-mail:sales@hkmjd.com

Company Address:Room1239, Guoli building, Zhenzhong Road, Futian District, Shenzhen, Guangdong

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