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Product Description:RDIMM Dual In-Line In-Line Memory Module with Memory
Package:BGA-288Product Description:RDIMM Dual In-Line In-Line Memory Module with Memory
Package:BGA-288Product Description:RDIMM Dual In-Line In-Line Memory Module with Memory
Package:BGA-288Product Description:RDIMM Dual In-Line In-Line Memory Module with Memory
Package:BGA-288Product Description:RDIMM Dual In-Line In-Line Memory Module with Memory
Package:BGA-288Product Description:Low-Power Dynamic Random Access Memory IC
Package:315-FBGAProduct Description:64Gbit LPDDR4X Dynamic Random Memory (DRAM) IC For Mobile Devices
Package:FBGA-200Product Description:Low-Power Dynamic Random Access Memory IC
Package:496-FBGAProduct Description:64Gbit LPDDR4X Dynamic Random Memory (DRAM) IC For Mobile Devices
Package:FBGA-200Product Description:Low-Power Dynamic Random Access Memory IC
Package:441-FBGAProduct Description:Low-Power Dynamic Random Access Memory IC
Package:496-FBGAProduct Description:8Gbit LPDDR4X Dynamic Random Memory (DRAM) IC For Mobile Devices
Package:FBGA-200Product Description:Low-Power Dynamic Random Access Memory IC
Package:441-FBGAProduct Description:Low-Power Dynamic Random Access Memory IC
Package:441-FBGAProduct Description:8Gbit LPDDR4X Dynamic Random Memory (DRAM) IC For Mobile Devices
Package:FBGA-200Product Description:Low-Power Dynamic Random Access Memory IC
Package:441-FBGAContact Number:86-755-83294757
Enterprise QQ:1668527835/ 2850151598/ 2850151584/ 2850151585
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E-mail:sales@hkmjd.com
Company Address:Room1239, Guoli building, Zhenzhong Road, Futian District, Shenzhen, Guangdong
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