sales@hkmjd.com
Service Telephone:86-755-83294757
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Product Description:Embedded Flash Solution for Bluetooth Audio Applications
Package:VFBGAProduct Description:The QRB5165 processor is customized for robotics applications
Package:BGAProduct Description:Commercial iot and artificial intelligence SoC processors
Package:BGAProduct Description:Higher performance and wider connectivity options (SOCs) for mid-range devices
Package:BGAProduct Description:Higher performance and wider connectivity options (SOCs) for mid-range devices
Package:BGAProduct Description:Higher performance and wider connectivity options (SOCs) for mid-range devices
Package:BGAProduct Description:Eight-core processor optimized for retail payment platforms
Package:BGAProduct Description:High-performance Bluetooth v5.4 chip for Bluetooth headsets and wearables
Package:WLCSPProduct Description:Fully Integrated front end module designed for Wi-Fi
Package:LGAProduct Description:Fully Integrated front end module designed for Wi-Fi
Package:LGAProduct Description:Automotive-grade Wi-Fi 7 access point solution
Package:BGAProduct Description:Tri-core, ultralow power Bluetooth LE SoC
Package:BGAProduct Description:Ultra-low power single-chip audio platform optimized for use in wireless earbuds
Package:WLCSP-99Product Description:Ultra-low power single-chip audio platform optimized for use in wireless earbuds
Package:WLCSP-99Product Description:Premium processor for the Internet of Things (IoT)
Package:BGAProduct Description:Optimize flash-programmable Bluetooth audio SOCs for Bluetooth headsets and headsets
Package:VFBGAContact Number:86-755-83294757
Enterprise QQ:1668527835/ 2850151598/ 2850151584/ 2850151585
Business Hours:9:00-18:00
E-mail:sales@hkmjd.com
Company Address:Room1239, Guoli building, Zhenzhong Road, Futian District, Shenzhen, Guangdong
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