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Product Description:24.75M Cache 3.10 GHz Xeon Platinum 8354H Processor
Package:FCLGA-4189Product Description:The RAA225019 is a highly configurable PMIC
Package:BGAProduct Description:AABP Pressure Sensor, 5.0VS, Digital SPI Output, HLNN Package
Package:HLNNProduct Description:38.5M Cache 2.60 GHz Xeon Platinum 8376HL Processor
Package:FCLGA-4189Product Description:38.5M Cache 2.60 GHz Xeon Platinum 8376H Processor
Package:FCLGA-4189Product Description:3.3VS, AABP Pressure Sensor, Digital SPI Output, HLNN Package
Package:HLNNProduct Description:AABP Pressure Sensor - Compact Piezoresistive Silicon Pressure Sensor, HLNN Package
Package:HLNNProduct Description:0PSI to 5PSI, AABP Pressure Sensor, Digital - I2C Output, HLNN Package
Package:HLNNProduct Description:38.5M Cache 2.90GHz Xeon Platinum 8380HL Processor
Package:FCLGA-4189Product Description:CoolSiC MOSFET separate 1200 V G2 TO 263-7
Package:PG-TO263-7Product Description:0PSI to 5PSI, AABP Pressure Sensor - Compact Piezoresistive Silicon Pressure Sensor
Package:HANNProduct Description:38.5M Cache 2.90GHz Xeon Platinum 8380H Processor
Package:FCLGA-4189Product Description:600 V CoolMOS S7TA power MOSFET
Package:PG-HDSOP-22Product Description:600 V CoolMOS S7T power MOSFETs
Package:PG-HDSOP-22Product Description:600 V CoolMOS S7T power MOSFETs
Package:PG-HDSOP-22Product Description:600 V CoolMOS S7TA power MOSFET
Package:PG-HDSOP-22Contact Number:86-755-83294757
Enterprise QQ:1668527835/ 2850151598/ 2850151584/ 2850151585
Business Hours:9:00-18:00
E-mail:sales@hkmjd.com
Company Address:Room1239, Guoli building, Zhenzhong Road, Futian District, Shenzhen, Guangdong
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