sales@hkmjd.com
Service Telephone:86-755-83294757
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Model
Brand
Parameter Description
MOQ
Stock
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Unit Price
Operation
Product Description:High performance, low power Bluetooth audio SoC
Package:VFBGA90Product Description:Entry-Level Flash Low-Power Bluetooth Audio SoC
Package:VFBGA-90Product Description:QCC-5125-0-CSP90-TR-00-0 is a low-power Bluetooth audio SoC family
Package:BGA90Product Description:High performance, low power Bluetooth audio SoC
Package:BGA124Product Description:High performance, low power Bluetooth audio SoC
Package:WLCSP81Product Description:The IPQ8074 is a highly integrated SoC
Package:BGAProduct Description:The IPQ8074 is a highly integrated SoC
Package:BGAProduct Description:Wireless wifi + Bluetooth module, compliant with IEEE802.11a/b/g/n/ac/ax BT5.1 standard
Package:BGAProduct Description:Wireless wifi + Bluetooth module, compliant with IEEE802.11a/b/g/n/ac/ax BT5.1 standard
Package:BGAProduct Description:Integrated Circuit IC Chips
Package:BGAProduct Description:Wireless NIC Chips
Package:QFNProduct Description:QCC-5124-0-CSP90-TR-00-0
Package:BGAProduct Description:SXR2130P
Package:SMDProduct Description:SXR-2130P-0-MPSP1099-TR-02-0-AA
Package:SMDProduct Description:QCC-5124-0-CSP90-MT-00-0
Package:BGAProduct Description:QCA7005-AL33
Package:QFNContact Number:86-755-83294757
Enterprise QQ:1668527835/ 2850151598/ 2850151584/ 2850151585
Business Hours:9:00-18:00
E-mail:sales@hkmjd.com
Company Address:Room1239, Guoli building, Zhenzhong Road, Futian District, Shenzhen, Guangdong
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