sales@hkmjd.com
Service Telephone:86-755-83294757
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Product Description:Application processor provides flexible connectivity, enhanced GPS and advanced camera capabilities
Package:QFNProduct Description:Snapdragon QAR2130P is used as a Development Kit based on Snapdragon® AR2 Gen 1 SoC
Package:QFNProduct Description:QXR2230P for Snapdragon® XR2 Gen 2 SoCs
Package:QFNProduct Description:Automotive Connectivity SoC with Integrated High Quality 2x2 Wi-Fi and Bluetooth 5.0 Performance
Package:QFNProduct Description:First MIMO +SISO Dual MAC, Dual Band Simultaneous Wi-Fi 5/ BT 5.1 Combo for Automotive market
Package:QFNProduct Description:Wi-Fi 6e Dual MAC 802.11ax MIMO DBS 2x2+ 2x2 BT 5.3 for Automotive Applications
Package:QFNProduct Description:Wi-Fi 6e Single MAC 802.11ax MIMO 2x2 Bluetooth 5.3 for Automotive Applications
Package:QFNProduct Description:APQ8053 System-on-Chip (SoC) Designed to Support Various Platforms for IoT Applications
Package:BGAProduct Description:System-on-Chip (SoC) with true global 5G, Wi-Fi 6E support
Package:QFNProduct Description:System-on-Chip (SoC) with true global 5G, Wi-Fi 6E support
Package:QFNProduct Description:System-on-Chip (SoC) with advanced camera, AI and compute features
Package:BGAProduct Description:System-on-Chip (SoC) with advanced camera, AI and compute features
Package:BGAProduct Description:System-on-Chip (SoC) with Wi-Fi 6 and 5G Internet of Things (IoT) support
Package:BGAProduct Description:System-on-Chip (SoC) incorporates the latest technologies in a highly integrated chipset
Package:QFNProduct Description:QCC711 Tri-core Ultra-Low Power Bluetooth® Low Energy (BLE) SoC
Package:QFNProduct Description:Qualcomm S3 audio platform supports Bluetooth 5.3, dual Bluetooth modes
Package:QFNContact Number:86-755-83294757
Enterprise QQ:1668527835/ 2850151598/ 2850151584/ 2850151585
Business Hours:9:00-18:00
E-mail:sales@hkmjd.com
Company Address:Room1239, Guoli building, Zhenzhong Road, Futian District, Shenzhen, Guangdong
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