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Shenzhen  Mingjiada Electronics Co., Ltd.

Service Telephone:86-755-83294757

Product Classification

AI Processor Chip

AI Accelerators

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Model

Brand

Parameter Description

MOQ

Stock

Purchase Quantity

Unit Price

Operation

QCC3071

Product Description:Qualcomm S3 audio platform supports Bluetooth 5.3, dual Bluetooth modes

Package:QFN
10pcs
1000
1 +
10 +
25 +
50 +
>=100
QCC-5171-0-WLNSP99-TR-04-0

Product Description:Bluetooth audio SoC, part of the Qualcomm S5 (QCC517x) audio platform

Package:QFN
10pcs
1000
1 +
10 +
25 +
50 +
>=100
QCC5171

Product Description:Bluetooth audio SoC, part of the Qualcomm S5 (QCC517x) audio platform

Package:QFN
10pcs
1000
1 +
10 +
25 +
50 +
>=100
QCC-3040-0-CSP90B-TR-01-0

Product Description:QCC-3040-0-CSP90B-TR-01-0

Package:BGA
10pcs
4000
1 +
10 +
25 +
50 +
>=100
SA415M

Product Description:LTE module AG525R-GL set with Qualcomm SA415M silicon solution

Package:BGA
10pcs
1000
1 +
10 +
25 +
50 +
>=100
WCD9385

Product Description:Applying the Pico Neo3 VR audio codec

Package:BGA
10pcs
1000
1 +
10 +
25 +
50 +
>=100
WSA8810

Product Description:Applying the Pico Neo3 VR audio amplifier

Package:BGA
10pcs
2000
1 +
10 +
25 +
50 +
>=100
PM3003A

Product Description:App Pico Neo3 VR powered by Qualcomm Snapdragon XR2 processor

Package:BGA
10pcs
1000
1 +
10 +
25 +
50 +
>=100
PM8150B

Product Description:App Pico Neo3 VR powered by Qualcomm Snapdragon XR2 processor

Package:BGA
10pcs
1000
1 +
10 +
25 +
50 +
>=100
PM8250

Product Description:App Pico Neo3 VR powered by Qualcomm Snapdragon XR2 processor

Package:BGA
10pcs
1000
1 +
10 +
25 +
50 +
>=100
PM8150L

Product Description:App Pico Neo3 VR powered by Qualcomm Snapdragon XR2 processor

Package:BGA
10pcs
1000
1 +
10 +
25 +
50 +
>=100
QCC-3026-0-81WLNSP-TR-00-0

Product Description:QCC3026 Entry-level flash programmable Bluetooth audio SoC based on ultra-low power architecture

Package:WLCSP
10pcs
1000
1 +
10 +
25 +
50 +
>=100
QCC3056

Product Description:Qualcomm QCC3056 Bluetooth Audio SoC, an ultra-low power, single-chip solution

Package:WLCSP
10pcs
1000
1 +
10 +
25 +
50 +
>=100
QCC-5151-0-WLNSP94B-TR-02-0

Product Description:QCC5151 in WLCSP package, 4*4mm-94pin, supports Bluetooth 5.2

Package:WLCSP-94
10pcs
1000
1 +
10 +
25 +
50 +
>=100
QCC-5141-0-WLNSP94B-TR-01-0

Product Description:Low Power Bluetooth Audio System-on-Chip

Package:WLCSP-94
10pcs
1000
1 +
10 +
25 +
50 +
>=100
QCC-5126-0-CSP90-TR-01-0

Product Description:QC5126 is part of the QCC5100 low-power Bluetooth audio SoC family

Package:BGA
10pcs
1000
1 +
10 +
25 +
50 +
>=100
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Contact Number:86-755-83294757

Enterprise QQ:1668527835/ 2850151598/ 2850151584/ 2850151585

Business Hours:9:00-18:00

E-mail:sales@hkmjd.com

Company Address:Room1239, Guoli building, Zhenzhong Road, Futian District, Shenzhen, Guangdong

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