sales@hkmjd.com
Service Telephone:86-755-83294757
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Product Description:System-on-Chip (SoC) incorporates the latest technologies in a highly integrated chipset
Package:QFNProduct Description:QCC711 Tri-core Ultra-Low Power Bluetooth® Low Energy (BLE) SoC
Package:QFNProduct Description:Qualcomm S3 audio platform supports Bluetooth 5.3, dual Bluetooth modes
Package:WLCSP-99Product Description:Qualcomm S3 audio platform supports Bluetooth 5.3, dual Bluetooth modes
Package:QFNProduct Description:Bluetooth audio SoC, part of the Qualcomm S5 (QCC517x) audio platform
Package:QFNProduct Description:Bluetooth audio SoC, part of the Qualcomm S5 (QCC517x) audio platform
Package:QFNProduct Description:QCC-3040-0-CSP90B-TR-01-0
Package:BGAProduct Description:LTE module AG525R-GL set with Qualcomm SA415M silicon solution
Package:BGAProduct Description:Applying the Pico Neo3 VR audio codec
Package:BGAProduct Description:Applying the Pico Neo3 VR audio amplifier
Package:BGAProduct Description:App Pico Neo3 VR powered by Qualcomm Snapdragon XR2 processor
Package:BGAProduct Description:App Pico Neo3 VR powered by Qualcomm Snapdragon XR2 processor
Package:BGAProduct Description:App Pico Neo3 VR powered by Qualcomm Snapdragon XR2 processor
Package:BGAProduct Description:App Pico Neo3 VR powered by Qualcomm Snapdragon XR2 processor
Package:BGAProduct Description:QCC3026 Entry-level flash programmable Bluetooth audio SoC based on ultra-low power architecture
Package:WLCSPContact Number:86-755-83294757
Enterprise QQ:1668527835/ 2850151598/ 2850151584/ 2850151585
Business Hours:9:00-18:00
E-mail:sales@hkmjd.com
Company Address:Room1239, Guoli building, Zhenzhong Road, Futian District, Shenzhen, Guangdong
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