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Trade Name:QCC711
Brand:QUALCOMM
Particular Year:23+
Package:QFN
Delivery Date:New and Original
Stock: 1000pcs
The Qualcomm® QCC711 is an industry-leading, triple-core, ultra-low-power Bluetooth® Low Energy SoC optimised for IoT applications such as beacons for asset location and tracking, smart health/fitness devices, remote control, computer peripherals, or Bluetooth connectivity for smart switches and sensors, building automation, and Wi-Fi devices in controls. The QCC711 supports Bluetooth 5.4 and single-mode Bluetooth low power.
Unlike other BLE devices on the market, the QCC711 is the first publicly available Bluetooth low-power device to integrate three microcontroller cores with 128KB of SRAM and 512KB of RRAM on-chip.
The QCC711 is driven by an open source software SDK available on GitHub. The QCC711 also comes with the Qualcomm® Connectivity Integrated Development Environment (QCCIDE) based on Microsoft Visual Studio Code (VSCode). The QCC711-specific VScode extension plug-in will be available as open source software to customise VSCode specifically for the QCC711.
Features
QCC711 triple-core, high-security Bluetooth low-power SoC with Bluetooth 5.4 and encoded PHY (long range) support
Advanced hardware-based security with dedicated RoT CPU and associated memory for trusted execution environments, secure boot, secure debugging, encrypted storage, key configuration and secure OTAs
Comprehensive range of peripherals and interfaces: QSPI, SPI, UART, I2C, FTC (PWM), ADC, MFP, PTA
Dual operation modes: no host (on-board BLE stack) or host mode (external host via UART)
Integrated power management unit with direct battery connection
On-chip RRAM (NVM) connectivity to host applications, no external NOR flash required
Specifications
CPU: Arm® Cortex®-M0 processor1, Arm® Cortex®-M3 processor2, RISC-V3
Bluetooth
Specification version: Bluetooth® 5.4
Security
Features: Secure Boot Secure Boot, Qualcomm® Trusted Execution Environment (TEE), Crypto Accelerator, Secure Debugging
Interfaces
Supported Interfaces PWM, I²C, GPIO, Temperature Sensor, SPI, UART, ADC, QSPI, Multi-Function Pin, Voltage Comparator, LED Driver
Package
Size: 5.6 × 5.6 × 0.85 mm
Pitch: 0.4 mm
Process Node and Technology
Process node: 40 nm
Model
Brand
Package
Quantity
Describe
QUALCOMM
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