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Trade Name:DRA781BRGABFRQ1
Data Manual:DRA781BRGABFRQ1.pdf
Brand:TI
Particular Year:23+
Package:367-BFBGA
Delivery Date:New and Original
Stock: 1000pcs
The DRA781BRGABFRQ1 processor is available in a 367-ball, 15 x 15 mm, 0.65 mm ball pitch (0.8 mm pitch rule available for signals) ball grid array (FCBGA) package. Via Channel™ Array (VCA) technology in a FCBGA package. The architecture is designed to provide high-performance concurrency for automotive coprocessors, hybrid radio and amplifier applications. In addition, Texas Instruments (TI) provides a full suite of development tools for both Arm and DSP, including a C compiler and debugger, and interfaces to view the execution of the source code.
Product Attributes
Type: Floating Point
Interfaces: CAN, DMA, I²C, McASP, McSPI, MMC/SD/SDIO, SPI, UART/USART
Clock rate: 750MHz
Non-volatile memory: ROM (16kB)
On-chip RAM: 512kB
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 3.3V
Voltage - Core: 1.06V
Operating Temperature: -40°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package/Housing: 367-BFBGA, FCBGA
Supplier Device Package: 367-FCBGA (15x15)
Applications
• Digital and analogue radios
• Hybrid radios
• Vehicle connectivity co-processor
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Texas Instruments (TI), abbreviated as TI, is the worlds leading semiconductor company providing innovative digital signal processing (DSP) and analog device technologies for real-world signal processing. In addition to the semiconductor business, it …
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