sales@hkmjd.com
Service Telephone:86-755-83294757
Trade Name:System On Chip (SoC)
Brand:QUALCOMM
Particular Year:24+
Package:BGA
Delivery Date:New and original
Stock: 1000pcs
The QCM4290-0-NSP752-TR-00-0-AA delivers maximum benefits and enhanced performance for mid-range devices. With the Kryo 260 CPU architecture and the higher rates and robust end-side performance achieved by the 3rd generation Qualcomm AI engine, the platform offers powerful performance, dynamic camera capabilities, and a wide range of connectivity options (support for LTE Cat13, Wi-Fi 6-Ready connectivity), making it ideal for industrial and commercial iot applications. Examples include industrial handheld devices, security panels and cameras in logistics and warehousing.
Features
Kryo® 260 CPU, octa-core CPU architecture, continuously increase speed *
The 11nm process technology improves performance and reduces power consumption *
Dual-band GNSS (L1 and L5) and support for the Indian NavIC satellite system
The Qualcomm fast connect 6100 system offers Wi-Fi 6-ready, integrated with a Wi-Fi subsystem with Bluetooth 5, WPA3 security, and Digital FM Bluetooth 5.1 is an improvement over the previous generation in terms of power performance
Dedicated Qualcomm Hexagon 683 DSP with dual Hexagon vector extension (dual HVX, 1.0 GHz)
Dual channel non-POP high-speed memory
LPDDR4x SDRAM designed for 1866 MHz clock (2 × 16 bit)
LPDDR3 SDRAM designed for 933 MHz clock (1 × 32 bit)
Qualcomm Universal Bandwidth Compression with Display and GPU (UBWC)
Display support :FHD+, four hardware layers, 10-bit end-to-end, and Qualcomm Real Palette display capabilities
A 4-channel DSI D-PHY 1.2, 1.5 Gbps per channel, support for separate links
3x ISP (13 MP + 13 MP)/(25 MP + 5 MP) at 30 frames per second
Three 4-channel CSI(4/4/4 or 4/4/2/1) D-PHY 1.2(2.5 Gbps per channel) or C-PHY 1.0(10 Gbps)(3.42 Gbps/trio)
Supports USB 3.1 Type-C
Long life cycle support for hardware and software
Model
Brand
Package
Quantity
Describe
QUALCOMM
BGA
1000
Higher performance and wider connectivity options (SOCs) for mid-range devices
QUALCOMM
BGA
1000
Higher performance and wider connectivity options (SOCs) for mid-range devices
QUALCOMM
QFN
1000
High-performance 1x1 2.4GHz Wi-Fi 6/BT/15.4 integrated SoC
QUALCOMM
QFN
1000
High-performance System-on-chip (SoC) designed for edge iot applications
BROADCOM
BGA
1000
4x4 802.11ax release 2 Wi-Fi 6/6E residential access point (AP) chip
A: all online goods on the shelves can be ordered online, but considering the large liquidity of spot inventory, it is not possible to achieve 100% accuracy at present. In case of any abnormality, you can contact our company online and give the corresponding solution.
A: our self-supporting products are from cooperative domestic and foreign original factories or authorized agents, and the source can be traced to ensure the original and authentic products.
A: at present, our self-employed brands TI,ST,ADI,NXP,LATTICE,CYPRESS,INFINEON,XILINX and other first-line brands. Other channels are the original factory and agency channels. If necessary, we can communicate and confirm according to the specific brand and model.
A: You can inquire through the website, or by phone and email.
A: the delivery date is marked in most commodity information. You can estimate the delivery time of the commodity according to the delivery date. The specific arrival time depends on the warehouse where the commodity is located and the logistics mode you choose.
A: you can issue ordinary invoices for individual users or special VAT invoices for enterprise users.
Qualcomm was founded in 1985 and is headquartered in San Diego, California, with more than 35,400 employees worldwide. Qualcomm is the worlds leading wireless technology innovator, transforming the way the world connects, computes and communicates. Co…
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Enterprise QQ:1668527835/ 2850151598/ 2850151584/ 2850151585
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E-mail:sales@hkmjd.com
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