sales@hkmjd.com
Service Telephone:86-755-83294757
Trade Name:SH63N65DM6AG
Data Manual:SH63N65DM6AG.pdf
Brand:ST
Particular Year:23+
Package:9-PowerSMD
Delivery Date:New original
Stock: 2000pcs
SH63N65DM6AG device combines two MOSFETs in a half-bridge topology. The ACEPACK SMIT is a very compact and rugged power module in a surface mount package for easy assembly. Thanks to the DBC substrate, the ACEPACK SMIT package offers low thermal resistance coupled with an isolated top-side thermal pad. The high design flexibility of the package enables several configurations, including phase legs, boost, and single switch through different combinations of the internal power switches.
Features
AQG 324 qualified
Half-bridge power module
650 V blocking voltage
Fast recovery body diode
Very low switching energies
Low package inductance
Dice on direct bond copper (DBC) substrate
Low thermal resistance
Isolation rating of 3.4 kVrms/min
Applications
Switching applications
Model
Brand
Package
Quantity
Describe
ST
8-PowerVDFN
2000
Automotive-grade dual N-channel STripFET™ F7 Power MOSFET Transistors
Microchip
Module
1000
MOSFET - Arrays 1700V (1.7kV), 1200V (1.2kV) 337A (Tc), 317A (Tc) 1.492kW (Tc) Chassis Mount
Microchip
Module
1000
MOSFET - Array 1200V (1.2kV), 700V 472A (Tc), 442A (Tc) 1.846kW (Tc), 1.161kW (Tc) Chassis Mount
Microchip
Module
10000
MOSFET - Arrays 1700V (1.7kV), 1200V (1.2kV) 124A (Tc), 89A (Tc) 602W (Tc), 395W (Tc) Chassis Mount
Microchip
Module
1000
MOSFET - Arrays 1200V (1.2kV), 700V 317A (Tc), 227A (Tc) 1.253kW (Tc), 613W (Tc) Chassis Mount
Microchip
Module
1000
MOSFET - Arrays 1200V (1.2kV), 700V 89A (Tc), 124A (Tc) 395W (Tc), 365W (Tc) Chassis Mount
Microchip
Module
1000
MOSFET - Arrays 700V 52A (Tc), 110A (Tc) 141W (Tc), 292W (Tc) Chassis Mount
Microchip
Module
1000
MOSFET - Array 1200V (1.2kV) 420A (Tc) 1.753kW (Tc) Chassis Mount
Microchip
Module
1000
MOSFET - Array 1200V (1.2kV) 173A (Tc) 745W (Tc) Chassis Mount
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