sales@hkmjd.com
Service Telephone:86-755-83294757
Trade Name:BES2600IHC-2X
Brand:BES
Particular Year:23+
Package:BGA
Delivery Date:New and Original
Stock: 1000pcs
BES BES2600IHC-2X Bluetooth Audio SoC. BES2600IHC series is a dual-core Arm MCU, currently including BES2600IHC-2X/4X, BES2600IHC3-6X two models, focusing on low-cost, cost-effective. BES2600IHC supports Bluetooth 5.3, equipped with BES self-developed AI noise-canceling call algorithm, hybrid ANC noise reduction algorithm, power consumption as low as 4.5mA.
Main features of BES2600IHC series: Dual-core ARM STAR-MC1; Support Bluetooth 5.3 specification; 512KB RAM; Power consumption as low as 4.5mA; Noise Floor as low as 3uV; Embed Charger as 4.2V, 4.35V; Support Hybrid ANC; Support Dual mic Beam-forming (BES). forming (BES), according to the different sub-models, Embed Flash is 1/2/4MB.
Model
Brand
Package
Quantity
Describe
REALTEK
QFN68
2000
Support for Bluetooth 5.3, ultra-low power, 2-in-1 watches and TWS solutions
NXP
HVQFN48
2000
KW45: 32-bit Bluetooth® 5.3, Remote MCU with CAN FD and LIN bus options, Arm® Cortex®-M33 core
NXP
HVQFN40
1000
32-Bit Bluetooth® 5.3 Long-Range MCUs with CAN FD and LIN Bus Options, Arm® Cortex®-M33 Core
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Hengxuan Technology (Shanghai) Co., Ltd. may be the most innovative chip design company in China. We focus on the R&D and sales of RF SOC chips for wireless Internet of Things platforms, and provide customers with SoCs with WIFI/BT wireless cable …
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