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Trade Name:OMAPL137DZKBA3
Data Manual:OMAPL137DZKBA3.pdf
Brand:TI
Particular Year:23+
Package:256-BGA
Delivery Date:Brand New Original
Stock: 1000pcs
The OMAPL137DZKBA3 is a low-power application processor based on the ARM926EJ-S and TMS320C674x DSP cores. The ability to quickly bring to market devices with robust OS support, rich user interface and high processing performance lifetime. User interface and high processing performance for maximum flexibility in a hybrid processor solution.OMAPL137DZKBA3's Dual-Core Architecture Offers the Benefits of a DSP and a Reduced Instruction Set Computer (RISC)The dual-core architecture offers the benefits of DSP and Reduced Instruction Set Computer (RISC) technology, integrating the high-performance TMS320C674x DSP core with the ARM926EJ-SDK core.The OMAPL137DZKBA3 is a 32-bit RISC processor core that executes either 32-bit or 16-bit instructions, and handles 32-bit, 16-bit, or 32-bit instructions.
The core uses a pipeline so that all parts of the processor and memory system can run continuously.The ARM core has a coprocessor 15 (CP15), protection module, data and programme memory management unit (MMU), and tableside buffers. Management Unit (MMU) with tableside lookahead buffers.The ARM core has a separate 16KB instruction cache and 16KB data cache. Both memory blocks are four-way associative with virtual indexed virtual tokens (VIVT).The ARM core also has 8KB of RAM (vector tables) and 64KB of ROM.The OMAP-L137 DSP core uses a L2 cache-based architecture. The Level 1 Data Cache (L1D) is a 32KB bi-directional set-associative cache. The Level 2 Program Cache (L2P) consists of 256-KB of memory space that is shared between program and data space.The L2 memory can be configured as mapped memory, cache, or a combination of both.
Product Attributes
Core processor: ARM926EJ-S
Number of cores/bus width: 1 core, 32-bit
Speed:375MHz
Co-processor/DSP: Signal Processing; C674x, System Control; CP15
RAM Controller:SDRAM
Graphics Acceleration: None
Display and Interface Controller: LCD
Ethernet:10/100Mbps (1)
SATA:-
USB:USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage - I/O:1.8V, 3.3V
Operating Temperature:-40°C ~ 105°C (TJ)
Safety Features:-
Mounting Type:Surface Mount
Package/Housing:256-BGA
Supplier Device Package:256-BGA (17x17)
Additional Interfaces:HPI, I²C, McASP, MMC/SD, SPI, UART
Applications
• Audio and video receivers
• Home theatre systems
• Automotive amplifiers
• Professional audio
• Speakers
• Network Streaming Audio
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Texas Instruments (TI), abbreviated as TI, is the worlds leading semiconductor company providing innovative digital signal processing (DSP) and analog device technologies for real-world signal processing. In addition to the semiconductor business, it …
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