sales@hkmjd.com
Service Telephone:86-755-83294757
Trade Name:NRF52810-CAAA-E-R7
Data Manual:NRF52810-CAAA-E-R7.pdf
Brand:NORDIC
Particular Year:23+
Package:WLCSP-33
Delivery Date:New and Original
Stock: 1000pcs
The NRF52810-CAAA-E-R7 supports the low power Bluetooth protocol, including a high speed transmission feature of 2 Mbps. It also supports ANT and 2.4 GHz private protocols. This chip is very energy efficient and is our smallest SoC in size (together with the nRF52811) in a 2.482 x 2.464 mm CSP package.
Specification
Product type: RF System on Chip - SoC
Type: Bluetooth 5.3
Core: ARM Cortex M4
Operating frequency: 2360 MHz to 2500 MHz
Maximum data rate: 2 Mbps
Output power: 8 dBm
Sensitivity: - 96 dBm
Supply voltage - min: 1.7 V
Supply voltage - maximum: 3.6 V
Receive supply current: 11.2 mA
Transmit supply current: 15.4 mA
Program memory size: 192 kB
Min. operating temperature: - 40 C
Max. operating temperature: + 85 C
Package / Case: WLCSP-33
ADC resolution: 12 bit
Data bus width: 32 bit
Data RAM size: 24 kB
Data Ram type: RAM
Height: 0.327 mm
Interface type: SPI
Length: 2.482 mm
Max. clock frequency: 64 MHz
Mounting style: SMD/SMT
Number of ADC channels: 8 Channel
Number of inputs/outputs: 32 I/O
Number of timers: 3 Timer
Operating supply voltage: 1.7 V to 3.6 V
Operating temperature range: - 40 C to + 85 C
Program memory type: Flash
Number of factory packages: 1500
Model
Brand
Package
Quantity
Describe
QUALCOMM
WLCSP-90
1000
Ultra-low power Wi-Fi SoCs designed to unlock new battery-powered iot applications
QUALCOMM
WLCSP-90
1000
Ultra-low power Wi-Fi SoCs designed to unlock new battery-powered iot applications
QUALCOMM
QFN
1000
1x1 2.4GHz Wi-Fi 6/ Bluetooth /802.15.4(Thread /ZigBee) 2-in-1 SoC
Renesas
WLCSP
2000
SmartBond™ Multi-Core Low Power Bluetooth® 5.2 SoC with Embedded Flash Memory
Renesas
WLCSP
2000
SmartBond™ Multi-Core Low Power Bluetooth® 5.2 SoC with Embedded Flash Memory
QUALCOMM
QFN-68
1000
Multi-mode intelligent connectivity solution integrating IEEE 802.15.4 and Bluetooth
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