sales@hkmjd.com
Service Telephone:86-755-83294757
Trade Name:Bluetooth Audio SOC
Brand:QUALCOMM
Particular Year:22+
Package:BGA
Delivery Date:New and Original
Stock: 10000pcs
The QCC-5144-0-CSP90B-TR-01-0 is an ultra-low-power, high-performance Bluetooth audio system-on-chip (SoC) developed by Qualcomm, specifically designed for advanced true wireless earbuds (TWS), wearable devices, and Bluetooth speakers. It is a high-end model within the Qualcomm QCC5100 series, featuring a powerful processing core, rich audio functionality, and a comprehensive RF system.
QCC-5144-0-CSP90B-TR-01-0 Core Features
Powerful Processing Core:
Built-in dual-core 32-bit processor architecture: one application processor (Qualcomm Kalimba™ DSP) for running complex audio algorithms and applications, and one programmable audio DSP specifically for audio decoding, echo cancellation, and noise reduction. Additionally, it integrates an ultra-low-power sensor hub (Sensor Hub) for processing sensor data without waking the main core, significantly reducing power consumption.
Advanced Bluetooth technology:
Supports the latest Bluetooth 5.3 standard, offering more stable connections, lower power consumption, and better coexistence.
Integrated Qualcomm TrueWireless™ Mirroring technology: This is one of its core advantages. It allows one earbud to connect to a smartphone via Bluetooth, while the other earbud automatically mirrors and synchronises with the main earbud. This provides seamless switching for single-ear use, lower latency, and better RF stability.
Supports dual Bluetooth mode, enabling simultaneous connection to two audio sources (e.g., smartphone and laptop) and easy switching between them.
Top-tier audio features:
Supports Qualcomm aptX™ Adaptive audio coding: Provides high-resolution, low-latency adaptive audio experiences, dynamically adjusting audio quality and latency based on network conditions.
Supports aptX Voice: Delivers ultra-wideband voice quality for clearer call audio.
Integrated Qualcomm Hybrid Active Noise Cancellation (Hybrid ANC) technology: Supports feedforward, feedback, and hybrid active noise cancellation, and can achieve adaptive noise cancellation, automatically adjusting noise cancellation effects based on the user's ear canal structure and changes in environmental noise.
Supports Qualcomm cVc™ echo cancellation and noise suppression technology, ensuring clear voice call quality even in noisy environments.
Powerful voice assistant integration:
Supports always-on voice wake-up (e.g., waking up Amazon Alexa, Google Assistant, or other custom voice assistants) while maintaining extremely low power consumption. Users can interact with the voice assistant without touching the headphones.
Ultra-low power consumption design:
Utilises advanced manufacturing processes and power management technology to significantly extend headphone playback time.
A dedicated low-power module handles tasks such as Bluetooth standby and sensor monitoring, maximising battery life.
High integration:
The chip integrates Bluetooth RF, audio codec, power management unit (PMU), and battery charger internally, significantly reducing the number of external components and lowering the overall solution size and cost.
QCC-5144-0-CSP90B-TR-01-0 Typical Applications
High-end true wireless stereo headphones
Active noise cancellation (ANC) headphones
Bluetooth voice assistant headphones
High-performance Bluetooth speakers
Gaming headphones
Model
Brand
Package
Quantity
Describe
QUALCOMM
VFBGA
2000
Support for Bluetooth 5.4, Qualcomm S5 3rd generation Bluetooth Audio SoC
QUALCOMM
VFBGA
2000
Support for Bluetooth 5.4, Qualcomm S5 3rd generation Bluetooth Audio SoC
QUALCOMM
QFN-80
1000
Extremely Low Power, Entry-Level Flash Bluetooth Audio SoC
QUALCOMM
WLCSP-99
1000
Single-chip Bluetooth audio SoC designed for USB dongles
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