sales@hkmjd.com
Service Telephone:86-755-83294757
Trade Name:CC2564CRVMR
Data Manual:CC2564CRVMR.pdf
Brand:TI
Particular Year:23+
Package:VQFNP-76
Delivery Date:New and Original
Stock: 9927pcs
The TI CC2564CRVMR device is a complete Bluetooth® BR, EDR and low-power HCI solution that reduces design effort and time to market. Based on TI's seventh-generation Bluetooth core, the CC2564CRVMR device provides a proven solution that is compliant with Bluetooth 4.2 standards. When used in conjunction with a microcontroller unit (MCU), the HCI device provides optimal RF performance with approximately twice the RF range of other Bluetooth low-power solutions. In addition, TI's power management hardware and software algorithms significantly reduce the power consumption of all common Bluetooth BR, EDR and low-power operation modes.
Specification
RF family/standards: Bluetooth
Protocol: Bluetooth v4.2
Modulation: 8DPSK, DQPSK, GFSK
Frequency: 2.4GHz
Data rate (max): -
Power - Output: 10dBm
Sensitivity: -96dBm
Memory Capacity: -
Serial Interface: UART
Voltage - Supply: 1.7V ~ 4.8V
Current - Receive: -
Current - Transmit: 112.5mA
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package/Case: 76-VQFN Double row of exposed pads
Supplier Device Package: 76-VQFNP-MR (8x8)
Applications
- Wireless audio solutions
- mPOS
- Medical devices
- Set-top boxes (STBs)
- Wearable devices
- Sensor Hubs, Sensor Gateways
- Home & Factory Automation
Model
Brand
Package
Quantity
Describe
INFINEON
QFN-56
1000
Bluetooth LE 5.4 MCU with Dual ARM Cortex M33 dedicated for applications and CAN FD
QUALCOMM
QFN
1000
Bluetooth version 5.0 qualified stack with optional features
QUALCOMM
QFN
1000
Bluetooth version 5.0 qualified stack with optional features
Renesas
WLCSP
2000
SmartBond™ Multi-Core Low Power Bluetooth® 5.2 SoC with Embedded Flash Memory
Renesas
WLCSP
2000
SmartBond™ Multi-Core Low Power Bluetooth® 5.2 SoC with Embedded Flash Memory
NXP
HVQFN48
2000
KW45: 32-bit Bluetooth® 5.3, Remote MCU with CAN FD and LIN bus options, Arm® Cortex®-M33 core
NXP
HVQFN40
1000
32-Bit Bluetooth® 5.3 Long-Range MCUs with CAN FD and LIN Bus Options, Arm® Cortex®-M33 Core
NXP
HVQFN40
1000
32-Bit Bluetooth® 5.3 Long-Range MCUs with CAN FD and LIN Bus Options, Arm® Cortex®-M33 Core
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Texas Instruments (TI), abbreviated as TI, is the worlds leading semiconductor company providing innovative digital signal processing (DSP) and analog device technologies for real-world signal processing. In addition to the semiconductor business, it …
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