sales@hkmjd.com
Service Telephone:86-755-83294757
Trade Name:MICROFJ-30035-TSV-TR
Data Manual:MICROFJ-30035-TSV-TR.PDF
Brand:ON
Particular Year:23+
Package:8-WBGA
Delivery Date:New and Original
Stock: 1000pcs
MICROFJ-30035-TSV-TR is Silicon Photomultipliers (SiPM), High PDE and Timing Resolution Sensors in a TSV Package. It is J-Series low-light sensors feature a high PDE (photon detection efficiency) that is achieved using a high-volume, P-on-N silicon foundry process.
Product Attributes
Wavelength: 420nm
Spectral Range: 200nm ~ 900nm
Diode Type: Avalanche
Response Time: 110ps
Voltage - DC Reverse (Vr) (Max): 24.7 V
Current - Dark (Typ): 1.9µA
Active Area: 9.43mm²
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 8-WBGA
Product Features
High-density microcells
Fast output terminal
Temperature stability of 21.5mV/°C
±250mV breakdown voltage uniformity
Available in a reflow solder-compatible TSV chip-scale package
Ultra-low dark count rates of 50kHz/mm2 typical
Optimized for high-performance timing applications, such as ToF-PET
3mm, 4mm, and 6mm sensor sizes
<30V bias voltage
50% photon detection efficiency (PDE) at 420nm
Improved signal rise time and microcell recovery time
Negates the need for active voltage control
High uniformity
TSV package results in almost zero dead space, allowing the creation of high fill factor arrays and is ferrous-metal free
Applications
Medical imaging
Hazard and threat
3D ranging and sensing
Biophotonics and sciences
High energy physics
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