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Mingjiada offers Samtec ACCELERate ® HD ultra-high density slim array connectors
In the fields of 5G communication, artificial intelligence and high-performance computing, the demand for equipment miniaturization and high-speed transmission continues to escalate. As a long-term partner of the Samtec brand, Shenzhen Mingjiada Elect…
In the fields of 5G communication, artificial intelligence and high-performance computing, the demand for equipment miniaturization and high-speed transmission continues to escalate. As a long-term partner of the Samtec brand, Shenzhen Mingjiada Electronics Co., Ltd. launched the ACCELERATE® HD series of ultra-high density slender array connectors to help customers meet complex system integration challenges with breakthrough design.
First, ACCELERATE® HD connector core technical advantages
1, Ultra-high density and high-speed transmission performance
ACCELERATE® HD features a 0.635mm pitch four-row layout that supports up to 240 high-speed Edge Rate® terminals per device (future expansion to 400+ pin positions). It meets PCIe® Gen 5, CXL® 3.1, and 100 GbE protocol requirements with 112 Gbps PAM4 (56 Gbps NRZ) transmission capabilities for high-speed interconnection between next-generation data centers and AI servers 23.
2. Compact structure design
The device height is only 5 mm (stack height is optional 5 mm or 10 mm), the width is compressed to 5 mm, combined with thin LCP insulator material, can save 70% of the board space, suitable for compact communication base stations, edge computing devices and on-board electronic modules 24.
3. Open pin field and signal integrity optimization
The unique open pin design supports flexible grounding and signal routing, and the Edge Rate® terminal system reduces insertion losses to 0.5 dB/inch (28 GHz), effectively supsets crosstalk noise, and ensures high-speed signal stability in complex electromagnetic environments 34.
2. Typical application scenarios and industry solutions
1. 5G communication equipment
In mmwave base stations and Massive MIMO antenna arrays, ACCELERATE® HD's 240-pin high density simplifies the RF front end and baseband unit interconnect architecture to support 14.0 GHz/28 Gbps high frequency signal transmission, reducing multichannel integration complexity 23.
2. AI Computing and Data center
3. Intelligent automotive electronics
To meet the fusion requirements of ADAS domain controller and on-board sensor, models such as APM6-060-01.5-S-04-2-A-TR are designed with ± 0.5mm floating tolerance to solve the problem of parallel assembly and alignment of multiple connectors, ensuring reliable connection of on-board system under vibration environment 47.
4, Industrial automation and medical equipment
In industrial robot joint control module and medical imaging equipment, its wide temperature range resistance of -55℃~+125℃ and IP67 protection level can cope with dust, oil pollution and high humidity environment, to ensure the long-term stable operation of key equipment 34.
Third, service advantages
1, spot inventory : standing CoolGaN™ full series of models, support small batch sample application and millions of orders delivery .
2, cross-border logistics : Shenzhen and Hong Kong double warehouse linkage, 48 hours to complete domestic delivery, 7 days to cover the Asia-Pacific .
3, one-stop procurement: to provide one-stop electronic components procurement services, can meet the various procurement needs of customers, so as to facilitate customer procurement and reduce procurement costs.
For sample or quotation information, please contact us at www.hkmjd.com.
Time:2025-03-29
Time:2025-03-29
Time:2025-03-29
Time:2025-03-29
Contact Number:86-755-83294757
Enterprise QQ:1668527835/ 2850151598/ 2850151584/ 2850151585
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E-mail:sales@hkmjd.com
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