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March 25, - Micron today announced that it has become the world's first and only storage vendor to ship both HBM3E and SOCAMM products.

According to the report, its SOCAMM memory for NVIDIA's GB300 Grace Blackwell Ultra superchips, as well as its HBM3E 12H 36GB for the HGX B300 platform, and its HBM3E 8H 24GB for the HGX B200 platform have been shipped in volume production.

Micron said SOCAMM, a modular LPDDR5X memory solution developed in collaboration with NVIDIA, is the world's fastest, smallest, lowest power and highest capacity modular memory solution.

Fastest: SOCAMM delivers up to 2.5x more bandwidth than RDIMM in the same capacity, enabling faster access to larger training data and more complex models, while increasing the amount of data transferred to inference workloads.

Smallest size: At 14x90 mm, the SOCAMM form factor is one-third the size of industry-standard RDIMMs, enabling smaller, more efficient server designs.

Lowest Power Consumption: The SOCAMM solution consumes one-third of the power of a standard DDR5 RDIMM, reshaping the power efficiency curve in AI architectures.

Highest Capacity: The SOCAMM solution uses four 16-layer stacks of LPDDR5X memory to create a 128GB high-capacity memory module, delivering the industry's highest-capacity LPDDR5X memory solution.

Optimal Expandability and Repairability: Micron's SOCAMM features a modular design and innovative stacking technology with ECC error correction, which also dramatically improves ease of repair and contributes to liquid-cooled server designs.

Minolta has learnt from Micron that its HBM3E 12H 36GB offers 50% more capacity than the HBM3E 8H 24GB in the same form factor. Compared to competing HBM3E 8H 24GB products, Micron's HBM3E12H 36GB consumes 20 per cent less power and has 50 per cent more storage capacity.