Welcome Here  Shenzhen Mingjiada Electronics Co., Ltd.

Recycle Espressif Modules Series Products:ESP32,ESP8266

Chip recycling process of Mingjiada Electronics:

1、Recycling object: recycling electronic materials / sluggish materials / factory inventory / electronic inventory / personal inventory, etc..

2, recycling types: recycling all kinds of IC chips, sensors, Ethernet, IGBT modules, AI artificial intelligence, microcontroller, Internet of Things and all other electronic materials.

3、Regular channel sources: the company only recycles regular channel sources, to ensure the quality of the recovered chips.

4、Recycling details: you will be backlog of IC/module inventory for simple classification, to determine the model, brand, production date, quantity and so on. Send it to our evaluation team by fax or email.

5、Testing and evaluation: The company will test the classified chips, including appearance inspection, performance test, etc. to evaluate their recycling value.

6、Recycling and trading: Based on the evaluation results, the company will negotiate with customers on specific trading methods, such as price and delivery methods.

Mingjiada is committed to establishing long-term relationships with customers and winning their trust with professional services and good reputation. By continuously optimising the recycling process and improving the recycling efficiency, we provide customers with more convenient and efficient recycling services and jointly promote the sustainable development of the electronics industry.

Espressif Modules

Espressif offers a wide range of fully-certified Wi-Fi & Bluetooth modules powered by our own advanced SoCs

ESP32 Modules —— 32-bit MCU & 2.4 GHz Wi-Fi & Bluetooth/Bluetooth LE

ESP32 embedded, two or one Xtensa® 32-bit LX6 microprocessor(s) with adjustable clock frequency, ranging from 80 MHz to 240 MHz

+19.5 dBm output power ensures a good physical range

Classic Bluetooth for legacy connections, also supporting L2CAP, SDP, GAP, SMP, AVDTP, AVCTP, A2DP (SNK) and AVRCP (CT)

Support for Bluetooth Low Energy (Bluetooth LE) profiles including L2CAP, GAP, GATT, SMP, and GATT-based profiles like BluFi, SPP-like, etc

Bluetooth Low Energy (Bluetooth LE) connects to smart phones, broadcasting low-energy beacons for easy detection

Sleep current is less than 5 μA, making it suitable for battery-powered and wearable-electronics applications

Peripherals include capacitive touch sensors, Hall sensor, SD card interface, Ethernet, high-speed SPI, UART, I2S and I2C

Fully certified with integrated antenna and software stacks

ESP8266 Modules —— 32-bit MCU & 2.4 GHz Wi-Fi

ESP8266 embedded, Xtensa® single-core 32-bit LX6 microprocessor, up to 160 MHz

+19.5 dBm output at the antenna ensures a good physical range

Sleep current is less than 20 μA, making it suitable for battery-powered and wearable-electronics applications

Peripherals include UART, GPIO, I2C, I2S, SDIO, PWM, ADC and SPI

Fully certified with integrated antenna and software stacks