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On August 31, according to analysts from Tianfeng International, Apple is indeed developing satellite communication for the iPhone 14/Pro series, and has completed hardware testing of this feature before mass production.
The Thread 1.3.0 release simplifies R&D and deployment investments for IoT device manufacturers and provides users with a seamless link experience.
On August 31, Toshiba Electronic Components and Storage Corporation ("Toshiba") announced today that it has launched a new power device, the third-generation silicon carbide (SiC) MOSFET "TWxxNxxxC series". This series features low…
ADI will increase the price of all products, including new orders and existing reservation demand, but did not disclose the specific increase, and the price increase will be implemented from September 25, 2022.
On August 30, the president of TSMC appeared today at the 2022 TSMC Technology Forum and mentioned that TSMC has been thinking about 3nm for a long time, maintaining the FF architecture and will be mass-produced. As for 2nm, mass production can also b…
On August 29, according to CCTV, the 2022 World New Energy Vehicle Conference will close on August 28. The relevant person in charge of the Ministry of Transport said that they will further support the development and application of new energy intelli…
It was reported on August 29 that Qualcomm has successively commercialized Snapdragon 8 and Snapdragon 7 this year, and now Snapdragon 6 is about to debut. Today, the whistleblower evleaks announced the detailed parameters of Qualcomm Snapdragon 6 (Sn…
According to Omdia data, the global smart home market is expected to continue to experience weak growth from 2021 until returning to an upward trajectory in 2023.
China Mobile Research Institute and China Mobile Zijin (Jiangsu) Innovation Research Institute officially released the worlds first 2.6GHz 5G integrated femtocell.
Qorvo, a leading RF chip manufacturer, is reducing the order volume of UMC, and has already listed a budget of US$110 million in its financial report to pay the long-term liquidated damages to outsourced wafer foundries.
据报道,25日晚间,供应链传出台积电因应通货膨胀、成本上扬,明年1月起将续调涨晶圆代工价格,先进制程平均调涨幅度3%,成熟制程约调涨5%-6%。受通膨等因素影响,电视、手机等消费电子需求趋缓,下半年半导体市况备受关注,市场也传出半导体供应链调节库存,晶圆代工厂成…
The production and sales of new energy vehicles are booming and the parts market is on fire.
Time:2025-08-22
Time:2025-08-22
Time:2025-08-22
Time:2025-08-22
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