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Toshiba launches third-generation SiC MOSFETs for more efficient industrial equipment
On August 31, Toshiba Electronic Components and Storage Corporation ("Toshiba") announced today that it has launched a new power device, the third-generation silicon carbide (SiC) MOSFET "TWxxNxxxC series". This series features low…
On August 31, Toshiba Electronic Components and Storage Corporation ("Toshiba") announced today that it has launched a new power device, the third-generation silicon carbide (SiC) MOSFET "TWxxNxxxC series". This series features low on-resistance, which significantly reduces switching losses. The 10 products in this series, including 5 1200V products and 5 650V products, have started shipping today.
The on-resistance per unit area (RDS(ON)A) of the new product has decreased by about 43%, resulting in a reduction of about 80% in the "drain-source on-resistance gate-drain charge (RDS(ON)Qgd)", which is reflected in the conduction. An important indicator of the relationship between pass loss and switching loss. This reduces switching losses by approximately 20%, while reducing on-resistance and switching losses. Therefore, the new product helps to increase the efficiency of the equipment.
Toshiba said that in the future, the IDM model of "epitaxial equipment + epitaxial wafer + device" will help them seize the railway, offshore wind power generation, data center and vehicle-mounted markets.
Time:2024-11-16
Time:2024-11-16
Time:2024-11-16
Time:2024-11-16
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