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RF chip leader Qorvo cuts off UMC, liquidated damages may be as high as 110 million US dollars
Qorvo, a leading RF chip manufacturer, is reducing the order volume of UMC, and has already listed a budget of US$110 million in its financial report to pay the long-term liquidated damages to outsourced wafer foundries.
According to a report on August 25, supply chain industry sources revealed that due to the unclear prospects for mobile phone chips, Qorvo, a leading RF chip manufacturer, is reducing the order volume of UMC Group, and has included a budget of US$110 million in the financial report to pay for outsourcing wafers. Foundry's long-term liquidated damages.
The report pointed out that Qorvo originally signed a long-term contract with the RF-SOI wafer foundry from 2022 to 2025, with a total contract value of up to 1.8 billion US dollars. However, according to market rumors, it has continued to revise down the purchase amount in recent months. In addition to the about $13 million in liquidated damages already paid in the last fiscal quarter, the follow-up will not be ruled out as destocking and subsequent liquidated damages.
Industry insiders admitted that Qorvo, Skyworks, Broadcom and other three major RF chip leaders in the United States also maintained a conservative attitude towards the mobile phone market in the second half of the year, and the orders released to Taiwanese manufacturers in the second half of the year were not optimistic. The industry expects that this round of destocking will take place by the end of the year at the earliest, and the PA and RF component-related businesses of wafer foundries such as Hongjieke, Wenmao, and Taiwan New Optoelectronics will decline in the second half of the year compared to the first half of the year.
Time:2024-11-16
Time:2024-11-16
Time:2024-11-16
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Time:2024-11-16
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