sales@hkmjd.com
Service Telephone:86-755-83294757
Trade Name:Wireless Connectivity
Brand:BROADCOM
Particular Year:24+
Package:BGA
Delivery Date:New and Original
Stock: 1000pcs
The BCM65454A0IFSBG is one of Broadcom's high-performance, high-density G.fast solutions designed to provide flexibility for DSLAM, MDU and DPU deployments.
The BCM65454A0IFSBG has the following features:
1. 4-Port G.fast Solution: The BCM65454A0IFSBG provides a 4-port G.fast solution that supports copper and coaxial cable transmission in both TDD (Time Division Duplex) and FDX (Full Duplex) modes.
2. High-speed SerDes interface: The chip has a high-speed SerDes interface that supports different rates from 1G to 25G to adapt to different network interface requirements.
3. Multi-mode and Auto-mode support: The BCM65454A0IFSBG supports G.fast, G.mgfast and xDSL protocols, and can independently select the supported mode on each channel.
4. Integrated AFE: This chip has an integrated analogue front end (AFE) that can support up to 20 lines.
5. Advanced system-level power management: The BCM65454A0IFSBG features an integrated DC/DC AVS controller and RPF support for advanced system-level power management.
6. Package and Process: The chip is packaged in a 29 x 29 mm Flip Chip Ball Grid Array (FCBGA) package with 1033 solder balls, 0.8 mm pitch, and embedded heat spreaders. It is fabricated using 16 nm CMOS technology.
7. Temperature range: The BCM65454A0IFSBG supports ambient temperature operation from -40°C to +85°C. The BCM65454A0IFSBG is designed to be used in a wide variety of applications.
8. Application Scenarios: This product is suitable for applications such as central office cabinets, MDUs (Multi-Dwelling Units) and DPUs (Data Path Units) for copper access networks, and 5G backhaul.
Model
Brand
Package
Quantity
Describe
QUALCOMM
VFBGA
2000
Support for Bluetooth 5.4, Qualcomm S5 3rd generation Bluetooth Audio SoC
QUALCOMM
VFBGA
2000
Support for Bluetooth 5.4, Qualcomm S5 3rd generation Bluetooth Audio SoC
QUALCOMM
BGA
2000
Support 4x4 MU-MIMO and 80MHz bandwidth wireless communication chip
QUALCOMM
BGA
2000
Support 4x4 MU-MIMO and 80MHz bandwidth wireless communication chip
QUALCOMM
BGA
2000
Support 4 antenna 160MHz bandwidth and 4KQAM high-performance wireless communication chip
QUALCOMM
BGA
2000
Support 4 antenna 160MHz bandwidth and 4KQAM high-performance wireless communication chip
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The BCM65452A0IFSBG is a multi-port G.fast solution IC product from Broadcom.Contact Number:86-755-83294757
Enterprise QQ:1668527835/ 2850151598/ 2850151584/ 2850151585
Business Hours:9:00-18:00
E-mail:sales@hkmjd.com
Company Address:Room1239, Guoli building, Zhenzhong Road, Futian District, Shenzhen, Guangdong
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