sales@hkmjd.com
Service Telephone:86-755-83294757
Trade Name:Wireless Connectivity
Brand:BROADCOM
Particular Year:24+
Package:BGA
Delivery Date:New and Original
Stock: 1000pcs
The BCM65452A0IFSBG is a multi-port G.fast solution IC product from Broadcom.
This product has the following features:
1. 16-port G.fast solution: The BCM65452A0IFSBG supports up to 16 G.fast interfaces for DSLAM, MDU (Multi-Dwelling Unit) and DPU (Data Path Unit) deployments.
2. Integrated AFE: This chip has an integrated analogue front end (AFE) that supports up to 20 lines.
3. SerDes support: With 16 SerDes channels, speeds from 1G to 25G, flexible network interface support (Ethernet with or without G.999.1), line card level binding and vectorisation.
4. Multi-mode and Auto-mode support: Each channel can optionally support G.fast, G.mgfast and xDSL protocols with built-in vectorisation support.
5. Power Management: Supports advanced system level power management features including integrated DC/DC AVS controller and RPF support.
6. Package: 29 x 29 mm Flip Chip Ball Grid Array (FCBGA) package with 1033 solder balls, 0.8 mm pitch and embedded heat spreader.
7. Process Technology: 16 nm CMOS technology is used.
8. Temperature Range: Supports ambient temperature operation from -40°C to +85°C.
9. Product Family: The BCM65452A0IFSBG is part of the BCM65450 family, which also includes other G.fast solutions in different configurations.
This product is suitable for application scenarios such as central office cabinets, MDU and DPU copper access networks, and 5G backhaul.The BCM65452A0IFSBG is capable of delivering symmetrical Gigabit services up to 1Gbps and supports the G.fastback ITU standard, which allows for the bundling of multiple copper wires into a single large conduit to achieve Gigabit speeds over longer distances.
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