sales@hkmjd.com
Service Telephone:86-755-83294757
Trade Name:Wireless Connectivity
Brand:BROADCOM
Particular Year:24+
Package:BGA
Delivery Date:New and Original
Stock: 1000pcs
The BCM65452A0IFSBG is a multi-port G.fast solution IC product from Broadcom.
This product has the following features:
1. 16-port G.fast solution: The BCM65452A0IFSBG supports up to 16 G.fast interfaces for DSLAM, MDU (Multi-Dwelling Unit) and DPU (Data Path Unit) deployments.
2. Integrated AFE: This chip has an integrated analogue front end (AFE) that supports up to 20 lines.
3. SerDes support: With 16 SerDes channels, speeds from 1G to 25G, flexible network interface support (Ethernet with or without G.999.1), line card level binding and vectorisation.
4. Multi-mode and Auto-mode support: Each channel can optionally support G.fast, G.mgfast and xDSL protocols with built-in vectorisation support.
5. Power Management: Supports advanced system level power management features including integrated DC/DC AVS controller and RPF support.
6. Package: 29 x 29 mm Flip Chip Ball Grid Array (FCBGA) package with 1033 solder balls, 0.8 mm pitch and embedded heat spreader.
7. Process Technology: 16 nm CMOS technology is used.
8. Temperature Range: Supports ambient temperature operation from -40°C to +85°C.
9. Product Family: The BCM65452A0IFSBG is part of the BCM65450 family, which also includes other G.fast solutions in different configurations.
This product is suitable for application scenarios such as central office cabinets, MDU and DPU copper access networks, and 5G backhaul.The BCM65452A0IFSBG is capable of delivering symmetrical Gigabit services up to 1Gbps and supports the G.fastback ITU standard, which allows for the bundling of multiple copper wires into a single large conduit to achieve Gigabit speeds over longer distances.
Model
Brand
Package
Quantity
Describe
REALTEK
QFP-156
1440
High-performance wireless communication chips designed to meet the needs of modern smart devices
NXP
eWLP-83
6000
2.4/5 GHz Dual-Band 1x1 Wi-Fi® 5 (802.11ac) + Bluetooth® 5.2 Solution
NORDIC
WLCSP50
7000
Multi functional Bluetooth 5.3 SoC supporting low-power Bluetooth, Bluetooth mesh, and NFC
NORDIC
QFN-73
10000
Multi-protocol Bluetooth 5.4 SoC with support for low-power Bluetooth, Bluetooth mesh, NFC, Thread and Zigbee
NORDIC
QFN-48
5000
Multiprotocol Bluetooth low energy and ANT/ANT+ and 2.4GHz proprietary System-on-Chip
NXP
QFN-48
3000
Bluetooth Low Energy and 802.15.4 Wireless Radio Microcontroller (MCU) based on Arm® Cortex®-M0+ Core
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Broadcom Corporation is a leading global semiconductor company for wired and wireless communications. Its products enable the delivery of voice, data and multimedia to and within the home, office and mobile environments. Broadcom provides manufacturer…
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