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20083EB0BD -- Elite Backplane Connector, DO 8 pairs, 12 positions, NiS

Specification attribute

Withstand voltage (V VAC) : 250

Current (A) : 0.5

Hole number (pin) : 192

Installation direction: vertical

Number of columns: 8

Column spacing (mm) : 3.00 (0.118)

Differential impedance (Ω) : 90

Terminal interface: Press-Fit

Rated voltage (V) : 3.3

Base material: Copper alloy

Coating: Gold

Material: LCP

Number of products per column: 12

Total product log: 96

Flame retardant: UL94V-0

Instructions

The ultra-high density 56+ Gbp/s PAM4 interconnect platform is optimized for traditional backplane, direct orthogonal and cable design solutions using proven pressure fit technology and single chip design.

• Impedance control performance up to 1 mm demate

• Each difference pair has 360 degree shielding

• Optimized dimensions for dual differential pair routing

• Single chip design can be expanded to accommodate multiple applications

• Integrated guidance minimizes valuable PCB edge space while providing powerful protection and alignment for today's demanding card designs

Applications

Data center

Switch

Router

Server and storage

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