sales@hkmjd.com
Service Telephone:86-755-83294757
Trade Name:BGM123N256V2
Brand:SILICON
Particular Year:24+
Package:Module
Delivery Date:New and Original
Stock: 2000pcs
The BGM123N256V2 module measures 6.5 x 6.5 x 1.4 mm, making it ideal for size-constrained applications.The BGM123 also integrates a high-performance, ultra-rugged antenna that requires minimal PCB, plastic, and metal clearance.The BGM123 requires a total PCB area of only 51 mm2.The BGM123 is certified for Bluetooth, CE, some FCC, Canadian ISED, and Japan. The BGM123 is Bluetooth, CE, partial FCC, Canadian ISED and Japan certified.
Based on the EFR32BG1 SoC, the BGM123 also integrates Bluetooth 4.2-compliant low-power Bluetooth, and can run end-user applications on-board or be used as a network co-processor through a host interface.
Key Features
• Bluetooth 4.2 low energy compliant
• Integrated antenna or RF pin
• TX power up to +8 dBm
• RX sensitivity: -90 dBm
• Range: up to 200 meters
• 32-bit ARM® Cortex®-M4 core at 38.4 MHz
• Flash memory: 256 kB
• RAM: 32 kB
• Autonomous Hardware Crypto Accelerator and Random Number Generator
• Integrated DC-DC Converter
• Onboard Bluetooth stack
The BGM123 SIP module can be used for a variety of applications:
• Wearables
• IoT end devices and gateways
• Health, sports and wellness devices
• Industrial, home and building automation
• Smart phone, tablet and PC accessories
• Beacons
Model
Brand
Package
Quantity
Describe
INFINEON
Module
2000
Bluetooth dual-mode modules with I2C, I2S, UART and PCM interfaces
U-BLOX
SiP
2000
Ultra-compact SiP, Bluetooth ® 5.1 Low Power module with integrated antenna (development CPU)
Microchip
Module
2000
Bluetooth ® dual-mode (BR/EDR/LE) module with integrated chip antenna
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