sales@hkmjd.com
Service Telephone:86-755-83294757
Trade Name:BCM43525C0KMMLW1G
Brand:BROADCOM
Particular Year:23+
Package:QFN
Delivery Date:New and Original
Stock: 1000pcs
Broadcom’s expanded portfolio includes the BCM43525C0KMMLW1G (3x3 11ac MU-MIMO) for high-performance access points. MU-MIMO combined with 160MHz enables devices to fully utilize available bandwidth to deliver more than 2x the performance.
The BCM43525C0KMMLW1G is further enhanced by NitroQAMTM, Broadcom’s 1024-QAM modulation scheme, which gives up to a 25 percent throughput boost over 802.11ac’s 256-QAM. In addition, by using a powerful Digital Signal Processing (DSP)-based architecture, Broadcomis the first silicon vendor able to perform advanced spectrum capture, analysis and classification right on the chip without impacting performance. Broadcom’s Advanced Spectrum Capture Engine (AsCE) allows the chip to identity non-Wi-Fi interference and adjust accordingly, delivering improved reliability and quality.
Features
3x3:3 Spatial Stream – 2.4/5GHz
NitroQAM
MU-MIMO
Up to three concurrent MU clients
Unique 2+1 mode to support
Integrated AsCE for spectrum analysis
Zero-wait DFStm
Applications
Access Points
Enterprise WLAN
Model
Brand
Package
Quantity
Describe
BROADCOM
BGA
1000
RF system-on-chip (SoC) chips suitable for 10G XPON DPU optical network units
BROADCOM
BGA
1000
RF system-on-chip (SoC) chips suitable for 10G EPON optical network units (ONUs)
NORDIC
WLCSP
1000
Fourth generation multi-protocol SoC based on 320MHz Arm Cortex-M33 core
SILICON
QFN-84
1500
SiWx917M series Wi-Fi 6 and Bluetooth Low Energy LE 5.4 SoC chip
SILICON
QFN-84
1500
SiWx917M series Wi-Fi 6 and Bluetooth Low Energy LE 5.4 SoC chip
SILICON
QFN-84
1500
SiWx917M series Wi-Fi 6 and Bluetooth Low Energy LE 5.4 SoC chip
SILICON
QFN-84
1500
SiWx917M series Wi-Fi 6 and Bluetooth Low Energy LE 5.4 SoC chip
SILICON
QFN-84
1500
SiWx917M series Wi-Fi 6 and Bluetooth Low Energy LE 5.4 SoC chip
SILICON
QFN-84
1500
SiWx917M series Wi-Fi 6 and Bluetooth Low Energy LE 5.4 SoC chip
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