sales@hkmjd.com
Service Telephone:86-755-83294757
Trade Name:RF System-On-Chip - SoC
Brand:BROADCOM
Particular Year:25+
Package:BGA
Delivery Date:New and original
Stock: 1000pcs
The BCM55045B1IFSBG is a highly integrated general-purpose PON OLT and MDU platform system-on-chip (SoC) processor device, supporting NGPON2, XGS-PON, 10G EPON, XG-PON, MDU, DPU and CBU applications. This device has been optimized for a wide range of service delivery and intelligent access applications.
The main technical features of BCM55045B1IFSBG include:
PON technical support: Compatible with GPON, EPON, and 10G EPON, supports the next-generation standard NGPON2/XGS-PON, and meets the requirements of symmetrical and asymmetric transmission.
High-speed interface integration: Integrated PON MACs, SerDes (high-speed serializer), dual RGMII (Gigabit Ethernet), four HSGMII (2.5G Ethernet), 10G XFI (Fiber interface) and PCIe port. It also has a built-in DDR3 controller, reducing the reliance on external cache and enhancing data throughput efficiency.
Energy efficiency design: Utilizing advanced manufacturing processes, the energy consumption during load operation is significantly lower than that of previous generations, making it suitable for high-density deployment scenarios (such as data centers).
Anti-interference capability: Enhanced electromagnetic compatibility design ensures signal stability in complex environments (such as industrial control).
Dedicated engine: Integrated hardware traffic management engine, supporting QoS classification and security encryption, meeting the needs of enterprise-level network latency-sensitive services (such as LTE base station backhaul).
Typical application scenarios of BCM55045B1IFSBG
Broadband access network: Provides 10Gbps bandwidth for households and multi-resident units (MDU), supporting 4K video and cloud gaming.
Data centers and metropolitan area networks: High-speed optical fiber interconnection is achieved through XFI interfaces to optimize backbone transmission in data centers.
Industry and Internet of Things: Applied in industrial control systems and smart home gateways to ensure the reliability of high-concurrency device connections.
Mobile infrastructure: Supports 5G fronthaul/backhaul, with low latency features that meet the edge computing requirements of base stations.
Model
Brand
Package
Quantity
Describe
BROADCOM
BGA
1000
RF system-on-chip (SoC) chips suitable for 10G EPON optical network units (ONUs)
NORDIC
WLCSP
1000
Fourth generation multi-protocol SoC based on 320MHz Arm Cortex-M33 core
SILICON
QFN-84
1500
SiWx917M series Wi-Fi 6 and Bluetooth Low Energy LE 5.4 SoC chip
SILICON
QFN-84
1500
SiWx917M series Wi-Fi 6 and Bluetooth Low Energy LE 5.4 SoC chip
SILICON
QFN-84
1500
SiWx917M series Wi-Fi 6 and Bluetooth Low Energy LE 5.4 SoC chip
SILICON
QFN-84
1500
SiWx917M series Wi-Fi 6 and Bluetooth Low Energy LE 5.4 SoC chip
SILICON
QFN-84
1500
SiWx917M series Wi-Fi 6 and Bluetooth Low Energy LE 5.4 SoC chip
SILICON
QFN-84
1500
SiWx917M series Wi-Fi 6 and Bluetooth Low Energy LE 5.4 SoC chip
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