sales@hkmjd.com
Service Telephone:86-755-83294757
Trade Name:EFR32MG12P433F1024IL125-C
Data Manual:EFR32MG12P433F1024IL125-C.pdf
Brand:SILICON
Particular Year:23+
Package:125-VFBGA
Delivery Date:New original
Stock: 2000pcs
EFR32MG12P433F1024IL125-C single-die solution provides industry-leading energy efficiency, ultra-fast wakeup times, a scalable high-power amplifier, an integrated balun and no-compromise MCU features.
Features
32-bit ARME Cortex-M4 core with 40 MHz maximum operating frequency
Scalable Memory and Radio configuration options available in several footprint compatible QFN packages
12-channel Peripheral Reflex System enabling autonomous interaction of MCU peripherals
Autonomous Hardware Crypto Accelerator and Random Number Generator
Integrated balun for 2.4 GHz and integrated PA with up to 19.5 dBm
transmit power for 2.4 GHz and 20 dBm transmit power for Sub-GHz radios
Integrated de-dc with RF noise mitigation
Model
Brand
Package
Quantity
Describe
BROADCOM
BGA
1000
RF system-on-chip (SoC) chips suitable for 10G XPON DPU optical network units
BROADCOM
BGA
1000
RF system-on-chip (SoC) chips suitable for 10G EPON optical network units (ONUs)
NORDIC
WLCSP
1000
Fourth generation multi-protocol SoC based on 320MHz Arm Cortex-M33 core
SILICON
QFN-84
1500
SiWx917M series Wi-Fi 6 and Bluetooth Low Energy LE 5.4 SoC chip
SILICON
QFN-84
1500
SiWx917M series Wi-Fi 6 and Bluetooth Low Energy LE 5.4 SoC chip
SILICON
QFN-84
1500
SiWx917M series Wi-Fi 6 and Bluetooth Low Energy LE 5.4 SoC chip
SILICON
QFN-84
1500
SiWx917M series Wi-Fi 6 and Bluetooth Low Energy LE 5.4 SoC chip
SILICON
QFN-84
1500
SiWx917M series Wi-Fi 6 and Bluetooth Low Energy LE 5.4 SoC chip
SILICON
QFN-84
1500
SiWx917M series Wi-Fi 6 and Bluetooth Low Energy LE 5.4 SoC chip
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A: You can inquire through the website, or by phone and email.
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A: you can issue ordinary invoices for individual users or special VAT invoices for enterprise users.
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