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Qualcomm Platforms Introduces Low-Power Bluetooth Audio SoC-QCC3024, QCC-3024-0-CSP90-TR-00-0

Qualcomm Platforms Introduces Low-Power Bluetooth Audio SoC-QCC3024, QCC-3024-0-CSP90-TR-00-0

Source:our siteTime:2024-07-11Views:

Shenzhen Mingjiada Electronics Co., Ltd. new and original Qualcomm launched QCC3024, QCC-3024-0-CSP90-TR-00-0 Entry-level flash memory low-power Bluetooth audio SoCQCC3024 chip introduction:The Qualcomm QCC3024 is an entry-level Flash programmable dua…

Shenzhen Mingjiada Electronics Co., Ltd. new and original Qualcomm launched QCC3024, QCC-3024-0-CSP90-TR-00-0 Entry-level flash memory low-power Bluetooth audio SoC


QCC3024 chip introduction:

The Qualcomm® QCC3024 is an entry-level Flash programmable dual-mode Bluetooth v5.0 audio SoC based on an extremely low-power architecture.


Available in a VFBGA package, the QCC3024 is designed to help customers reduce development time and cost when developing Bluetooth stereo headsets.


QCC3024 Block Diagram

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QCC3024 Specifications

CPU

Architecture: 32-bit

Clock frequency: up to 32 MHz

Function: Programmable CPU

Digital Signal Processor

Name: 1x Qualcomm® Kalimba™

Clock frequency: 1x 120 MHz

Data RAM: 256 kB

Program RAM: 80 kB

Function: Configurable DSP

Bluetooth

Specification version: Bluetooth® 5.0

Connectivity Technologies: Bluetooth Low Power, Bluetooth Classic, Dual Mode Bluetooth

Topology: Qualcomm Broadcast Audio Technology

Classic Data Rate: 2 Mbps

Low Energy Features: Bluetooth Low Energy Sensor Hub

Audio

Support for Qualcomm® cVc™ Echo Cancellation and Noise Suppression (ECNS) technology: 2-microphone headset, 1-microphone headset, Qualcomm® cVc™ Echo Cancellation and Noise Suppression technology

Voice Services

Digital Assistant Activation: Pushbutton

Power Consumption

Amperage: Less than 6 mA

Interfaces

Supported interfaces: I²S, QSPI, I²C, UART, SPI

Audio playback interface

Mode: Stereo

Package

Type: VFBGA

Pinout: 90 pins

Pitch: 0.5 mm


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