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As service robots, companion robots, and industrial assistive robots accelerate their adoption, the industry is placing higher demands on the integration and response efficiency of robotic systems. Sweet Potato Robotics has launched the RDK S100, an integrated robot development platform designed for multi-scenario applications. This platform employs a heterogeneous architecture combining CPU, BPU, and MCU to tightly integrate core computation, path planning, and execution control, making it suitable for diverse application scenarios such as home services, intelligent companionship, industrial inspections, and medical assistance. This places higher demands on wireless communication capabilities, requiring stability and reliability, as well as low power consumption and ease of integration.

To meet these requirements, Infineon's AIROC™ CYW55572 chip provides robust wireless communication support for Sweet Potato Robotics' RDK S100 integrated computing and control robot development kit. This SoC chip, which integrates Wi-Fi 6 and Bluetooth® 5.3, not only meets the performance standards of Wi-Fi 6/6E but also maintains low-latency, high-speed stable connections in multi-device and complex environments, fully unleashing the potential of edge AI and IoT devices.

High-speed connectivity, low-latency response

The CYW55572 is a highly integrated wireless communication chip supporting dual-band 2.4GHz/5GHz and 2x2 MIMO technology, with a transmission rate of up to 1.2Gbps. This ensures smooth video data transmission and instant execution of control commands even under high network load conditions, significantly enhancing the real-time response and operational efficiency of the RDK S100 robot.

Utilising Wi-Fi 6 technologies such as OFDMA and MU-MIMO, the CYW55572 dynamically allocates wireless resources, effectively improving communication efficiency in multi-device operation scenarios. The TWT (Target Wake Time) feature enables the robot to automatically enter a low-power state during idle periods, effectively reducing overall power consumption, making the robot more energy-efficient and durable during high-intensity tasks.

Expanding the boundaries of human-machine interaction

The CYW55527 also integrates Bluetooth® 5.3 dual-mode functionality, further enhancing the RDK S100's short-range communication capabilities:

Supports LE Audio and Auracast™ broadcasting for high-quality wireless audio transmission;

Compatible with Bluetooth remote controls, wearable devices, auxiliary sensors, and other smart terminals, expanding the collaborative dimensions between robots, users, and the environment;

Offers multiple transmit power options (0 / 13 / 20 dBm) to flexibly accommodate different communication ranges and power consumption requirements.

The CYW55572 provides robots with flexible and stable local interaction capabilities, offering robust and reliable connectivity support for high-speed real-time data collection and transmission during training.

Rich interface integration and environmental adaptability optimisation

In practical applications, the CYW55572 offers a variety of interfaces (such as PCIe, SDIO, UART, I2S, PCM), enabling seamless connection with the RDK S100 expansion module. This facilitates the integration of perception units such as cameras, radars, and voice recognition systems, enhancing the robot's environmental perception and interaction capabilities, thereby enabling broader applications in fields such as services, industry, and healthcare.

Additionally, the CYW55572 features multi-layer security mechanisms and coexistence optimisation capabilities, ensuring the stability of communication links and the secure operation of systems, making it suitable for demanding industrial and commercial environments. Its wide temperature operating range (-40°C to 85°C) and compact packaging design not only enhance environmental adaptability but also provide greater flexibility and space utilisation for robot system design.

From technology selection to system integration, the CYW55572 helps developers significantly shorten product time-to-market and reduce overall development costs with its powerful connectivity, optimised power management, rich interface support, and mature software development toolchain. At the same time, the chip's high scalability also leaves ample room for future product feature upgrades and performance iterations.

As robotics technology continues to advance, the combination of the CYW55572 and RDK S100 is driving robot systems toward higher levels of collaborative efficiency and connection stability. This solution not only meets the high standards for wireless communication in current robotics applications but also provides a solid foundation for future technological innovations and application expansions.