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Shenzhen Mingjiada Electronics Co., Ltd. provides new and original Qualcomm/Qualcomm QCC3044 Bluetooth Audio SoC, QCC-3044-0-CSP90B-TR-01-0 Extremely low-power Bluetooth audio SoC in BGA package designed for mid-level to entry-level stereo headsets and earphones.

QCC3044 Bluetooth chip introduction:

The Qualcomm QCC3044 is an entry-level flash-programmable Bluetooth audio SoC based on an extremely low-power architecture designed for Bluetooth stereo headphones and earbuds with support for Qualcomm aptX, aptX HD, and aptX Adaptive, as well as Qualcomm Active Noise Cancellation.The QCC3044 is available in a VFBGA package The QCC3044 is available in a VFBGA package, enabling a solution that reduces development time and cost.

QCC3044 chip specifications:

Specification

Flash

Density: 32 megabytes

Location: Internal

Central Processor

Architecture: 32-bit 32-bit

Clock Frequency: Up to 32 MHz

Function: Programmable CPU

Digital Signal Processor

Name: 1x Qualcomm® Kalimba™

Clock frequency: 2x 120 MHz

Data RAM: 448 kB

Programme RAM: 112 kB

Function: Configurable DSP

Bluetooth

Specification version: Bluetooth® 5.2 certified

Connection technologies: Bluetooth Low Power, Bluetooth Classic, Bluetooth Dual Mode

Classic data rates: 3 Mbps1, 1 Mbps, 2 Mbps2

Audio

Supports Qualcomm® aptX™ audio technologies: Qualcomm® aptX™ Audio, Qualcomm® aptX™ Adaptive, Qualcomm® aptX™ HD

Supports Qualcomm® active noise cancellation (ANC) technologies: feedback, feed-forward, hybrid

Supports Qualcomm® cVc™ Echo Cancellation and Noise Suppression (ECNS) technology: 2-microphone headset, 1-microphone headset, 1-microphone speaker, Qualcomm® cVc™ Echo Cancellation and Noise Suppression

Voice Services

Ecosystem: Amazon Voice Services, Google Assistant

Digital Assistant Activation: Pushbutton

Power Consumption

Amperage: Less than 6 mA

Audio Characteristics

Resolution: 24-bit

Audio Playback Interface

Mode: Stereo

Package

Type: VFBGA

Pinout: 90 pins

Size: 5.9 × 5.6 × 1 mm

Pitch: 0.5 mm

Summary:

Qualcomm's advanced Bluetooth® audio platforms, the second-generation Qualcomm® S5 audio platform and the second-generation Qualcomm® S3 audio platform, both with support for Snapdragon Sound™ Snapdragon Listening technology, are feature-rich and ultra-low-power, bringing new characteristics to Snapdragon Sound Snapdragon Listening These include spatial audio support with dynamic head tracking, optimised lossless music streaming and an extremely low latency gaming experience of 48ms between phone and earbuds. It provides the best silicon solution for flagship audio products of major brands.

Contact: Mr Chen

Tel: +86 13410018555

Email: sales@hkmjd.com

Website: www.hkmjd.com