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VSC7427XJG-02 VSC7425XJG-02 88E6190-A0-TLA2C000

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Integrated Circuit Chip

Ethernet RS-232 interface integrated circuit Video Amplifiers CAN Transceiver Server Management Processor High Bandwidth Bus Switch Differential Amplifiers Analogue Crosspoint Switch HDMI Transmitter Laser Driver Analog Switch IC Ultrasonic receiver Multiplexer and demultiplexer Video Processor Video Encoder Interface-Serial Digital Interface (SDI) IC AI chips Interface-retimer Transimpedance Amplifiers CXL Near Memory Accelerator and Memory Expansion Controller Analog multiplier RS-422/RS-485 Interface IC Isolated CAN transceiver Instrumentation Amplifiers

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2G Module 4G Module 5G Module IoT Module New Energy Module Vehicle-Grade Module Smart Module Memory Module Cellular IoT Module Satellite Communication Module GNSS Module LPWA Modules IoT Chips

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Wi-Fi 6 Bluetooth IC Bluetooth 5.1 Bluetooth 5.0 Bluetooth 5.2 Wireless Communication Chip Near Field Communication (NFC) WiFi Bluetooth Wi-Fi chip Ultra Wideband UWB IC GNSS Receiver Wi-Fi 4 WiFi Modules Bluetooth Low Power Wi-Fi 5 Wi-Fi 7 Wireless Communication Module Wireless NIC Chips Bluetooth Module WiFi Wireless Module Bluetooth Audio SoC

AI Processor Chip

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Transistor - FET, MOSFET - Single Bipolar (BJT) transistor Silicon Carbide (SiC) JFET Silicon Diodes Power Modules Radio frequency transistor Power MOSFET Modules Silicon Carbide (SIC) FET Modules Silicon Carbide (SIC) FETs MOSFET a canale P Transistors - RF FETs, MOSFETs MOSFET Modules Thyristor Diode array module MOSFET Transistor N-Channel MOSFET IGBT Transistor Diodes & Rectifiers Schottky Diodes & Rectifiers Single Zener Diodes Bipolar Transistor Array Power Driver Module Diodes - Rectifiers - Single Transistor - FET, MOSFET - Array

Power Management

Gallium Nitride (GaN) ICs Linear Regulator LDO AC-DC Controller And Voltage Regulator DC-DC Power Products Voltage Reference Battery Management Boost controller Power over Ethernet (PoE) controller

Connectors

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Accelerometer Magneto-Resistive Sensors Angle sensor Hall Effect Switches Inductive sensor Hall Effect Latch and Switch Biosensor Time-of-Flight Sensors Sensor Signal Conditioners Optical Sensors Flow Sensors Board Mounted Humidity Sensor Biometric Sensors Speed Sensors Humidity Sensor Hall effect current sensor Ultrasonic Sensor Optical Sensors,Photodiodes Humidity, Moisture Sensitive Sensors Optical detectors and sensors-Infrared detectors Board Mount Temperature Sensor Gas Sensor Position Sensor Industrial Millimetre Wave Radar Sensors

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NOR Flash Nonvolatile Memory Random access memory RAM Static random access memory SRAM Synchronous dynamic random access memory SDRAM SSD Controllers AI Memory. F-RAM LPDDR5 uMCP EEPROM Solid State Drives - SSD Standard Serial EEPROM Automotive Grade Serial EEPROM eMMC Pseudo Static Random Access Memory (PSRAM) Erasable Programmable ROM NAND Flash Universal Flash Storage - UFS Dynamic random access memory DRAM Memory - Modules

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Supply, Recycle [NXP Bluetooth LE Audio] NXH3675UK Bluetooth 5.3 Low Energy Audio Chip

Supply, Recycle [NXP Bluetooth LE Audio] NXH3675UK Bluetooth 5.3 Low Energy Audio Chip

Source:our siteTime:2024-07-03Views:

Shenzhen Mingjiada Electronics Co., Ltd Supply, Recycle [NXP Bluetooth LE Audio] NXH3675UK Bluetooth 5.3 Low Energy Audio ChipProduct DescriptionNXH3675UK is a highly efficient Bluetooth 5.3 LE audio chip designed to function with minimum power consum…

Shenzhen Mingjiada Electronics Co., Ltd Supply, Recycle [NXP Bluetooth LE Audio] NXH3675UK Bluetooth 5.3 Low Energy Audio Chip


Product Description

NXH3675UK is a highly efficient Bluetooth® 5.3 LE audio chip designed to function with minimum power consumption and optimized for ultra-low latency applications, ideally suited for wireless audio applications, such as gaming headsets, wireless speakers, microphones, conference speakerphones and hearables. It enables multi-stream audio, including broadcast, and supports HQ audio (TMAP) and other standard audio profiles. 


Key Features

Application Processors: Dual core Cortex-M0+

Flash Memory: Embedded Flash

Audio Processors: Dual CoolFlux DSP

Bluetooth: Bluetooth 5.3 LE Audio certified and enables Auracast

Power Management

- Integrated PMU

- Li-ion battery

Audio

- LC3 and LC3plus

- Hi-Res Audio (LC3plus, 48/96 kHz)

- Equalizer and filtering

- Voice processing

Voice

- Dual digital microphones

- Smart boom - beam forming

General

- Radio PHY conforms to Bluetooth Low Energy 5.3 Bluetooth specification

- Low number of external passive components

- Operating temperature −20 °C to 85 °C


NXH3675 Headset Application Block Diagram:

1.jpg


If you have a requirement, please call Mr. Chen for advice at:

Tel: +86 13410018555

E-mail: sales@hkmjd.com

Home page URL: www.hkmjd.com

STGWA30HP65FB2 trench gate field cut-off 650 V, high speed HB2 series IGBT Return to
column Qualcomm Next-Generation QCC-3084-0-CSP134A-TR-05-0/QCC3084 Flash-Programmable Bluetooth Audio SoCs

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