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New Flip Chip-Lattice-Grid-Array (FC-LGA) Package Offers Excellent RF Performance with Side Wettable Pad for Automotive Grade Quality Requirements

Nexperia announces a series of bi-directional electrostatic discharge (ESD) protection diodes with high signal integrity in an innovative flip chip planar grid array (FC-LGA) package. This new packaging technology is specifically optimised to protect and filter the high-speed data communication links that are increasingly prevalent in modern automobiles. Applications such as in-vehicle camera video links, Gigabit automotive Ethernet networks and infotainment interfaces such as USBx, HDMIx and PCIex are protected from potentially damaging ESD events.

Flip chip packages have very few parasitic components and require no bonding wires or copper leadframes, ensuring high performance and excellent signal integrity.Nexperia's new 2- and 3-pin FC-LGA diodes have ultra-low capacitance (<0.25 pF) and insertion loss (-3 dB at 14.6 GHz), which are critical for high data rate applications. Low capacitance and low insertion loss are critical for high data rate applications. Two flip chip packages, the 2-pin DFN1006L(D)-2 and the 3-pin DFN1006L(D)-3, are available in the same dimensions as the standard package, ensuring plug-and-play compatibility. Up to 6 GHz bandwidth increase is available compared to conventional DFN technology. In addition, the 3-pin devices are able to protect both channels and provide capacitive matching, saving more space while further improving circuit performance and stability.

This new diode family, in addition to providing excellent signal integrity, has a wide reverse operating voltage (Vrwm) range, including 5 V, 18 V, 24 V and 30 V options. Higher voltage devices offer the added advantage of flexible placement on the board to protect multiple devices connected at various points along the link, and Nexperia is able to offer ESD protection diodes in flip-chip packages with side-wetted pads (SWFs), such as PESD5V0H1BLG-Q in the DFN1006LD-2 package and DFN1006LD-3 package, as well as the PESD5V0H1BLG-Q in the DFN1006LD-3 package. DFN1006LD-3 package, such as the PESD5V0H2BFG-Q in the DFN1006LD-2 package and the PESD5V0H2BFG-Q in the DFN1006LD-3 package. Thanks to this, solder joints can be inspected using automated optical inspection (AOI) to meet the stringent quality requirements of the automotive industry, where safety is a top priority.

These newly launched diodes combine side wetted pads with a DFN1006 package optimised for signal integrity, providing a significant improvement over what is currently available,’ said Alexander Benedix, head of Nexperia's Protection and Filtering product group. Designed to support the growing trend of data-intensive automotive applications, these diodes demonstrate Nexperia's proven expertise in packaging technology. This new product launch further underscores our commitment to delivering innovative solutions to meet the evolving needs of engineers in a wide range of industries.’

The first three 5 V flip chip diodes are now in volume production. Six 18 V, 24 V and 30 V products are currently available for sampling and will enter volume production in the second quarter of 2025.