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On 7 August, media reports indicated that SK Hynix, one of the worlds earliest mass producers of HBM4 memory, is providing critical solutions for AI chips. Leveraging its exclusive supply chain relationship with NVIDIA and its technological leadership…
On 7 August, media reports indicated that SK Hynix, one of the world's earliest mass producers of HBM4 memory, is providing critical solutions for AI chips. Leveraging its exclusive supply chain relationship with NVIDIA and its technological leadership, SK Hynix plans to increase the price of HBM4, with a potential premium of up to 70% compared to HBM3E.
Industry sources indicate that in the first half of this year, the unit price of 12-layer stacked HBM4 supplied by SK Hynix to NVIDIA was approximately $500, which is 60%-70% higher than the price of HBM3E of the same specification (approximately $300).
This aggressive pricing stems from its near-monopoly position in HBM3E supply for NVIDIA's Blackwell Ultra product portfolio and its first-mover advantage in the HBM4 sector. The higher prices also reflect the complexity of next-generation HBM manufacturing technology, particularly the cost considerations associated with selecting TSMC's 4nm process for producing the base die.
Facing intense competition in the high-profit HBM market, Samsung is accelerating the development and mass production of its 1cnm DRAM technology. Drawing on past experience, Samsung has shifted its strategy to a more cautious approach: rather than blindly pursuing early HBM4 supply, it is focusing on developing a mature product capable of stable supply to secure adoption by customers like AMD and NVIDIA, ensuring long-term reliable returns. As the HBM4 era approaches, competition among leading manufacturers is expected to be even more intense than during the HBM3/HBM3E era.
Time:2025-08-09
Time:2025-08-09
Time:2025-08-09
Time:2025-08-09
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