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The Qualcomm Snapdragon XR2 (SXR2130P) is the company's newest and most powerful virtual and extended reality processor, and Facebook recently announced that it will find adoption in their Oculus Quest 2 standalone VR headset.

But now it seems that the use of this processor will go far beyond virtual reality applications, because Longtron Technology has launched a Snapdragon XR2 SoM and Open-Q 865XR system-on-module designed for AI boxes, video conferencing systems, Multi-camera systems, machine vision platforms, advanced high-resolution multi-display systems, medical imaging and handheld data collectors.

Open-Q™ 865XR SOM Specifications

processor

Qualcomm® SXR2130P SoC based on 7nm technology

Kryo™ 585 Octa Core CPU: 1 Kryo Gold prime @ 2.84 GHZ + 3 Kryo Gold @ 2.42 GHz + 4 Kryo Silver @ 1.81 GHz

Hexagon™ DSP with four Hexagon Vector eXtensions

Adreno™ 650 GPU @ Fmax = 587 MHz

Spectra™ 480 Image Signal Processor

Adreno™ 665 Video Processing Unit

Adreno™ 995 Display Processing Unit

NPU230 Neural Processing Unit

SPU240 Safety Processing Unit

memory/storage

6GB LPDDR5 + 64GB UFS or 8GB LPDDR5 + 128GB UFS

wireless

FCC/ISED (Canada)/RED (EU) pre-certified Wi-Fi and Bluetooth

Wi-Fi 6 – 802.11ax 2×2 MU-MIMO

Bluetooth 5.1, ready for Bluetooth Milan

display interface

Up to three 4K monitors (1 internal via DSI and 2 external via DisplayPort)

2x 4-lane MIPI DSI D-PHY 1.2, up to 5040 × 2160 @ 60 fps (or 120 Hz in VR mode) + touchscreen support

DisplayPort v1.4 over USB Type-C, 8.1 Gbps/lane, with USB3 and USB2 data concurrency

camera interface

3 x 4-lane MIPI CSI camera ports + CCI I2C control

Spectra 480 ISP supports multiple concurrent cameras

64 MP 30 fps ZSL with dual ISP

Video performance

Video decoding up to 4K240/8K60

Video encoding up to 4K120/8K30

Concurrent 4K60 decode and 4K30 encode for wireless display

vocal

Supports WCD938x High Definition Audio Codec and WSA881x Speaker Amplifier on Carrier Board

Dedicated Hexagon™ Audio DSP

SoundWire, MI2S, DMIC, TDM/PCM interfaces for audio devices on carrier boards

high speed connection

1x PCIe Gen3 2 lanes

1 USB3.1, supports Type-C + DisplayPort v1.4, supports USB SS data concurrency

1x USB 3.1 Type-A

Input and output interface

4-bit SD 3.0, UART, I2C, I3C, SPI, configurable GPIO, sensor I/O to dedicated Hexagon™ sensor DSP

Power/Battery

Power Management and Battery Charging Solutions on SOM

Operating environment

Input voltage: 3.7V nominal

Operating temperature: -25°C to +85°C Tc (component case temperature)

Constituents

50mm x 29mm with 2x 100-pin + 1x 120-pin board-to-board connector

OS support

Android™ 10

It is reported that the performance of the Snapdragon XR2 artificial intelligence engine is twice that of the previous generation, up to 15 TOPS (trillion operations per second), and the company provides Android 10 BSP for the module, noting that "SW may not support all hardware. Function".