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March 13, [2025] - Infineon Technologies AG announces a new generation of high-density power modules that will play a key role in enabling AI and high-performance computing. The new OptiMOS™ TDM2454xx four-phase power module achieves industry-leading power density and reduces total cost of ownership (TCO) for AI data centre operators by boosting system performance and combining it with Infineon's consistent robustness.

TDM24XX kaveri

The OptiMOS™ TDM2454xx four-phase power module enables true Vertical Power Delivery (VPD) and delivers an industry-leading current density of 2 Amps/mm2 . This module continues the OptiMOS™ TDM2254xD and TDM2354xD dual-phase power modules introduced by Infineon last year, which continue to deliver superior power density for accelerated computing platforms. In traditional horizontal power supply systems, current needs to flow through the surface of the semiconductor wafer, which results in increased resistance and significant power losses. Vertical power supply improves system efficiency by shortening the current transfer path and reducing resistive losses.

According to the International Energy Agency (IEA), data centres currently account for 2% of global energy consumption. Driven by AI developments, data centre power demand is expected to grow by 165% between 2023 and 2030. Continuously improving power conversion efficiency and power density from the grid to the motherboard core is key to further improving computing performance and reducing TCO.

We are pleased to extend Infineon's high-performance AI data centre solutions with the OptiMOS™ TDM2454xx VPD module,’ said Rakesh Renganathan, vice president of the Power IC product line at Infineon Technologies. We are taking a 3D design approach and leveraging industry-leading power devices, packaging technologies, and our deep system heritage to deliver high-performance, energy-efficient computing solutions that further our corporate mission to drive digitisation and decarbonisation.’

By utilising Infineon's powerful OptiMOS™ 6-trench technology power assemblies and embedded chip packages, the OptiMOS™ TDM2454xx module delivers excellent electrical and thermal performance, while utilising innovative ultra-thin inductor design techniques to continually push the limits of VPD system performance and quality. In addition, the OptiMOS™ TDM2454xx structure is designed to facilitate modular splicing and improve current conduction, resulting in improved electrical, thermal and mechanical performance. The module supports up to 280 A in a four-phase power supply and incorporates an embedded capacitor layer in a small package of only 10x9 mm², which in combination with Infineon's XDP™ controllers enables stable and durable high current density power solutions.

The OptiMOS™ TDM2454xx module further strengthens Infineon's special position in the market. With a broad product and technology portfolio based on all relevant semiconductor materials, Infineon is able to power different AI server configurations from grid to core in a more energy-efficient way.