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Shenzhen Mingjiada Electronics Co., Ltd. supply Module M66FBTEA-03-STD Ultra-compact quad-band GSM/GRPS module in LCC wafer package, brand new and original, quality assurance, welcome to call!

Manufacturer：Quectel

Model No: M66FBTEA-03-STD

Batch: Latest

Protocol: Bluetooth v3.0, GSM, GPRS  

Frequency: 850MHz, 900MHz, 1.8GHz, 1.9GHz  

Data Rate: 85.6kbps  

Sensitivity: -109dBm  

Serial Interface: UART  

Antenna Type: Antenna not included   

Voltage - Supply: 3.3V ~ 4.6V  

Current - Receive: 1.3mA  

Mounting Type: Surface Mount  

Operating Temperature: -40°C ~ 85°C  

Package/Housing: 52-SMD Module

Device Description

The M66 R2.0 is an ultra-compact quad-band GSM/GRPS module in an LCC wafer package. Based on the latest 2G chipset, the M66 R2.0 is an ultra-compact quad-band GSM/GRPS module in an LCC cast package. Highly Compact The highly compact form factor of 17.7mm × 15.8mm × 2.3mm makes it an excellent choice for size-sensitive applications.

The M66 R2.0 uses surface mount technology, making it an ideal solution for ruggedised designs. The low-profile M66 R2.0 with surface mount technology is the ideal solution for durable, rugged designs. Reliable connection to the application. This package is ideal for mass production where cost and efficiency are critical. This package is ideal for mass production where cost and efficiency are critical.

With its compact form factor, low power consumption, and wide temperature range, the M66 R2.0 is the best choice for M2M applications such as wearables, automotive, industrial PDAs, personal tracking, wireless POS, smart metering, telematics, etc., telematics, etc., telematics, etc., M2M applications.

Key Benefits

Extremely compact quad-band GSM/GPRS module

LCC package for easier soldering

Power consumption as low as 1.3mA

Supports voice and QuecFOTA® functionality

Embedded with powerful Internet service protocols, multiple sockets and IP addresses

The company only recycles regular sources, such as agents, traders, terminal factories, etc., and does not accept sources that are not regular sources.

Honestly recycle a series of modules such as: 5G, new energy, IoT, IoT, automotive, automotive grade, base station, communication, artificial intelligence, RF, home appliance, thyristor, medical, industrial, Bluetooth 5.0, Ethernet, sensor, optical module, DC/DC, WiFi, LPWA, GNSS, IGBT and a series of modules.

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