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(Qualcomm) Ultra-Low Power Bluetooth QCC711, QCS7230 System-on-Chip (SoC) with Powerful Performance

(Qualcomm) Ultra-Low Power Bluetooth QCC711, QCS7230 System-on-Chip (SoC) with Powerful Performance

Source:our siteTime:2023-11-06Views:

Shenzhen Mingjiada Electronics Co., Ltd. introduces (Qualcomm) ultra-low-power Bluetooth QCC711, QCS7230 system-on-chip (SoC) that incorporates the latest technology in a highly integrated chipset with powerful performance and excellent features.Intro…

Shenzhen Mingjiada Electronics Co., Ltd. introduces (Qualcomm) ultra-low-power Bluetooth QCC711, QCS7230 system-on-chip (SoC) that incorporates the latest technology in a highly integrated chipset with powerful performance and excellent features.


Introduction

1. The QCC711 is an industry-leading, triple-core, ultra-low power Bluetooth® low energy SoC optimised for IoT applications such as beacons for asset location and tracking, smart health/fitness devices, remote control, computer peripherals, or Bluetooth connectivity for smart switches and sensors, and for Wi-Fi devices in building automation and control. The QCC711 supports Bluetooth 5.4 and single-mode Bluetooth low power.


Unlike other BLE devices on the market, the QCC711 is the first publicly available Bluetooth low-power device that integrates three microcontroller cores with on-chip 128KB SRAM and 512KB RRAM.


Features

QCC711 triple-core, high-security Bluetooth low-power SoC with support for Bluetooth 5.4 and encoded PHY (long range)

Advanced hardware-based security with dedicated RoT CPU and associated memory for trusted execution environments, secure boot, secure debugging, cryptographic storage, key configuration and secure OTAs

Comprehensive range of peripherals and interfaces: QSPI, SPI, UART, I2C, FTC (PWM), ADC, MFP, PTA

Dual operation modes: no host (on-board BLE stack) or host mode (external host via UART)

Integrated power management unit with direct battery connection

On-chip RRAM (NVM) for connecting to host applications, no external NOR flash required


2. QCS7230 The chip is designed for enterprise and commercial IoT applications such as video collaboration, smart cameras, connected healthcare, smart retail and more.


The QCS7230 provides a powerful heterogeneous computing architecture with the Qualcomm® AI Engine to efficiently run complex AI and deep learning workloads as well as device edge inference with incredibly low power consumption.


Features

Qualcomm® Kryo™ 585 CPU, 1x Kryo Gold (2.8GHz) + 3x Gold @2.42GHX + 2x Kryo Silver (1.8GHz) with 4MB L3 cache

Camera Dual 14-bit Qualcomm Spectra™ 480 ISP supports 64MP single camera shooting

Qualcomm® Adreno™ 650 GPU for improved GPU performance and power efficiency

Native 8-bit integer support for efficient GPU DNNs

Integrated DNN and Qualcomm® Neural Processing SDK framework for machine learning, advanced VA with quad Hexagon Vector eXtensions (HVX) V66Q, 1.5 GHz Hexagon DSPs

Supports up to 24 cameras or 7 concurrent cameras

Superior image quality in zzHDR, video denoising, low and mid-range denoising, lens shading correction, and video super-resolution

Support for three 4K displays

Video/Display: Parallel UHD encode/decode, 2x display ports, MIPI-DSI

Unrivalled video processing power, up to 4K240 decode/4K120 encode, multiple video codecs

Computer vision: CVP 2.0 for improved video denoising, digital video stabilisation and image correction adjustments

Neural Processing Unit (NPU) for high performance and always-on neural network (NN) use cases

Audio: Multi-microphone, source tracking, ECNS, voice activation

5G modem accessory with support for frequencies up to 6GHZ and millimetre waves

2x2 11ax 80MHz support for faster downloads

Qualcomm Video Collaboration Reference Design feature set

Support for Android 10 operating system


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