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The electronics industry is undergoing a rapid transition to more compact and powerful systems. To support this trend and further drive innovation at the system level, Infineon Technologies AG, the global semiconductor leader in power systems, automotive and IoT, is expanding its CoolSiC™ MOSFET 650 V single-tube portfolio with two new product families in Q-DPAK and TOLL packages.

CoolSiC™ MOSFET 650 V G2 Q-DPAK TSC

Top- and bottom-cooled and based on CoolSiC™ Generation 2 (G2) technology, these two product families offer significant improvements in performance, reliability and ease of use. They have been developed specifically for use in medium to high power switched mode power supplies (SMPS), including AI servers, renewable energy, charging piles, electric vehicles and humanoid robots, televisions, drives, and solid state circuit breakers.

The TOLL package has excellent thermal cycling on board (TCoB) capability, enabling compact system designs by reducing printed circuit board (PCB) footprint. When used in SMPS, it also reduces system-level manufacturing costs, and the TOLL package is now available for more targeted applications, enabling PCB designers to further reduce costs and better meet market demands.

The launch of the Q-DPAK package complements Infineon's new Top Cooled (TSC) products under development, including CoolMOS™ 8, CoolSiC™, CoolGaN™ and OptiMOS™. The TSC products enable customers to achieve excellent robustness as well as higher power densities and system efficiencies at a low cost, and also increase direct heat dissipation up to 95%, by better space management and reduced parasitic effects by enabling double-sided PCBs.

Availability

The CoolSiC™ MOSFET 650 V G2 in TOLL package is now available in R package DS (open) from 10 to 60 mΩ, while Q-DPAK models are available in 7, 10, 15 and 20 mΩ.