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SK Hynix announced today that it will participate in the International Consumer Electronics Show (CES 2025), which will be held in Las Vegas from 7 to 10 January local time, and will showcase its strength in AI-oriented memory technology.

It is understood that SK Hynix will display representative AI-oriented memory products such as HBM and enterprise SSDs at CES2025, as well as solutions optimised for end-side AI and next-generation AI-oriented memory products.

Currently, the company has been the first to achieve mass production and supply 12-layer fifth-generation HBM (HBM3E) to customers, and will exhibit samples of 16-layer fifth-generation HBM (HBM3E), which the company announced the completion of development in November last year. This product enables 16-layer stacked products for the advanced MR-MUF process, while enhancing control of warpage issues and improving its exothermic performance.

In addition, the company will showcase high-capacity, high-performance enterprise SSD products that are experiencing a surge in demand with the expansion of AI data centres, including SK Hynix subsidiary Solidigm's ‘D5-P5336’ 122TB product developed in November last year, which achieves the largest capacity of any existing product.

SK Hynix will also showcase end-side AI-oriented products such as ‘LPCAMM2’ and ‘ZUFS4.0,’ which are designed to improve data processing speed and energy efficiency by implementing AI on edge devices such as PCs and smartphones. The company will also exhibit CXL and PIM, which will become the core infrastructure of next-generation data centres, as well as CMM-Ax and AiMX, which modularise CXL and PIM.

Official explanations of some of the products are as follows:

LPCAMM2 (Low Power Compression Attached Memory Module 2): A module solution based on LPDDR5X, which is capable of replacing two existing DDR5 SODIMMs with space-saving, low-power and high-performance features.

ZUFS (Zoned Universal Flash Storage): Products that improve data management efficiency based on Universal Flash Storage (UFS). The product manages data efficiently by storing data with similar characteristics in the same zone to optimise data transfer between the operating system and storage.

AiMX (Accelerator-in-Memory based Accelerator): Accelerator card products based on SK Hynix's PIM product GDDR6-AiM chips.