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February 28 - During Mobile World Congress 2023 (MWC Barcelona 2023), KWT, the world's leading provider of IoT wireless communication solutions and wireless communication modules, officially announced the Fx190/Fx180 series of 5G R17 modules based on Qualcomm's latest generation Snapdragon X75 and X72 5G modems and RF systems.

The Fx190 series is based on the Snapdragon X75 5G modem and RF system, and is compliant with the 3GPP R17 evolutionary standard, supporting R17-related features. The Snapdragon X75 features a quad-core A55 processor, a new software suite and a number of world-first features to push the boundaries of connectivity, including network coverage, latency, energy efficiency and mobility. The Snapdragon X75 is the first modem and RF system to feature a dedicated hardware tensor accelerator (the second-generation Qualcomm?5G AI processor) that delivers a 2.5x improvement in AI performance over the first generation and introduces the second-generation Qualcomm?5G AI suite, which supports multiple advanced AI-based features. The Snapdragon X75-equipped Fx190 series leverages AI capabilities to support breakthrough 5G performance, powerfully empowering 5G AIoT devices.

In terms of transmission rate and signal coverage, the Fx190 series supports more Sub-6GHz and millimeter wave bands to help end-users enjoy 5G networks anywhere, anytime. Fx190 series terminals can realize both millimeter wave and Sub-6GHz on the network at the same time, with rate overlay aggregation function, even in complex environments can be stable and fast reception signal wave, the highest downlink peak can reach 10Gbps, to achieve 5G signal without scenario limitation use.

In addition to the Snapdragon X75 5G modem and RF system-based Fx190 series, KWT also launched the Snapdragon X72-based Fx180 series, which supports up to 400MHz bandwidth and downlink NR 4CA in the millimeter wave band, and 200MHz bandwidth and downlink NR 3CA in the NR Sub-6GHz, with a maximum downlink rate of 4.4 Gbps with both aggregations. The Fx180 series is optimised for the FWA market, supporting gigabits of uplink and downlink speeds.

The above breakthrough 5G performance of the Snapdragon X75/X72-based Fx190/Fx180 series will bring better 5G transmission rates, network coverage, low latency, low power consumption and high power efficiency to end devices, helping to create superior broadband experiences in mobile broadband, industrial Internet, fixed wireless access (FWA) and 5G enterprise private networks.

To fully meet the deployment and connectivity needs of 5G FWA devices, the FG190/FG180 series support rich peripheral interfaces, including 3 PCIe, 2 USXGMII, as well as UART, I2S, USB 3.1, UIM, etc., with enhanced peripheral connectivity and expandability to flexibly support a variety of FWA solutions, including CPE solutions for tri-band Wi-Fi 7 ( These include the tri-band Wi-Fi 7 CPE solution (BE19000) and the dual-band Wi-Fi 7 MiFi solution (BE5800), both of which support advanced Wi-Fi 7 features including extended 6GHz spectrum performance, MLO Multi-Link Operation, 160MHz/320MHz bandwidth support, and 4K QAM modulation technology. The FG190/FG180 series are available in LGA packages that are more suitable for FWA terminals and support Open CPU, which greatly simplifies the FWA development process, resulting in higher terminal integration and lower development costs.