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TSMC's 3nm process capacity has gradually increased, and is expected to reach 45000 wafers
Apple has booked TSMCs full capacity for the initial volume production of its 3nm process, which will reach 45,000 wafers next month.
On February 24th, according to foreign media reports, after Samsung Electronics adopted the 3nm process technology of all-around gate transistor architecture for mass production, TSMC still adopted the 3nm process technology of fin field-effect transistor, and also officially began commercial production on December 29th last year.
TSMC's monthly production capacity of 3nm process is gradually increased, and is expected to reach 45000 wafers next month
According to the latest reports from foreign media, like the previous process of TSMC, the production capacity of the 3nm process mass produced in December last year is also gradually increasing, and the monthly production capacity will reach 45000 wafers next month.
According to the report, Apple booked the full capacity of TSMC's 3nm process at the initial stage of mass production. Referring to the monthly energy output of TSMC's process, it said that it would reach 45000 wafers next month.
However, even though the capacity of TSMC's 3nm process is continuously improving, the capacity of this process will still be tight this year.
Time:2024-11-18
Time:2024-11-18
Time:2024-11-18
Time:2024-11-18
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