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Rockchip and BlackBerry QNX Join Forces to Help Automotive OEMs and Tier 1s Drive Digital Cockpits

Rockchip and BlackBerry QNX Join Forces to Help Automotive OEMs and Tier 1s Drive Digital Cockpits

Source:our siteTime:2024-11-29Views:

29th November 2024 - Rockchip Electronics Limited (Rockchip), an innovative AIoT chip solutions provider in China, today announced the development of an automotive digital cockpit platform based on Rockchips RK3588M flagship automotive-specification c…

29th November 2024 - Rockchip Electronics Limited (Rockchip), an innovative AIoT chip solutions provider in China, today announced the development of an automotive digital cockpit platform based on Rockchip's RK3588M flagship automotive-specification chip, in collaboration with BlackBerry QNX. The platform applies the QNX® Hypervisor and QNX® RTOS, as well as other QNX technologies, as the underlying software and is designed to help automotive OEMs and Tier 1s develop innovative products for intelligent mobility.


This advanced digital cockpit was commercialised earlier this year and has been successfully deployed in a number of domestic OEMs, and Rockchip will be showcasing this new QNX-enabled digital cockpit platform at the 2024 QNX Annual Developer Conference in Shanghai's Jing'an District on Thursday, 5 December.


‘BlackBerry QNX is highly aligned with our vision for next-generation automotive products, which is dedicated to delivering functionally secure, reliable, high-performance and trustworthy products to automotive OEMs and Tier 1s,’ said Feng Chen, senior vice president at Rockchip. ‘By combining QNX's strengths in fundamental software with our flagship automotive-specification chips, we provide automakers with a one-stop solution that can take the in-vehicle experience to the next level for both drivers and passengers.’


‘We are excited to work with Rockchip on the next generation of smart cockpit technology to drive its widespread deployment in mass production models with the latest BlackBerry QNX technology,’ said Dhiraj Handa, vice president, BlackBerry QNX Asia Pacific. ‘BlackBerry QNX has a wealth of expertise and a long history of delivering cutting-edge software solutions, while our commitment to functional security, network information security and reliability makes us a trusted partner for the automotive industry.’


The RK3588M is Rockchip's flagship smart cockpit solution, featuring an advanced architecture with quad-core A76+quad-core A55 octa-core CPUs, 100K DMIPS CPU architecture with 8K display/video, native 7-screen display, 6T NPUs, QNX Hypervisor, Dual 16M ISPs, and a 12-way camera. The chip is particularly suitable for automotive instrumentation, smart cockpit, centre control system and infotainment domain control unit (DCU) application scenarios. Supported by QNX Hypervisor, this advanced solution will drive innovative upgrades in commercial and passenger vehicles.


The Board Support Package (BSP) for Rockchip's RK3588M flagship automotive-specification chip is now available with support for the QNX® Neutrino® Real-Time Operating System (RTOS) 7.1 and QNX Hypervisor 2.2, enabling embedded automotive software developers to further develop automotive applications. Earlier this year, a digital cockpit demonstration platform based on the Rockchip RK3588M chip and QNX Hypervisor was released, demonstrating the safety-critical and hybrid-critical nature of cyber information in both functional and non-functional safety domains, and leading to the successful implementation of a number of domestic OEM digital cockpit mass production projects.


QNX, as the cornerstone of the software-driven future, is trusted by the world's leading OEMs and Tier 1s, including BMW, Bosch, Continental, Dongfeng Motor, Geely, Honda, Mercedes-Benz, Toyota, Volkswagen, Volvo globally as well as virtually all OEMs and Tier 1s in China. Its base software supports future-proof engineering, from intelligent digital cockpits and automated driver assistance systems (ADAS) to body domain controllers and high-performance computing platforms, helping automakers bring innovations to market faster and at lower cost.

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